SCHEMBL14735550

SCHEMBL14735550

CC(C)(C)c1ccc2c(c1)C([Zr](C1=CC=CC1)=C(c1ccc(Cl)c3ccccc13)c1ccc(Cl)c3ccccc13)c1cc(C(C)(C)C)ccc1-2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14735619 0.92
Hydrochloric Acid SCHEMBL813016 0.85 MAPK14 (0.30)
SCHEMBL18142168 0.85
SCHEMBL14735645 0.82
SCHEMBL18092805 0.82
SCHEMBL2803241 0.81 ALDH1A1 (0.31)
Hydrochloric Acid SCHEMBL851746 0.80 NPC1 (0.31)
Hydrochloric Acid SCHEMBL812467 0.80 NPC1 (0.31)
Hydrochloric Acid SCHEMBL13585099 0.79 RORB (0.32)
SCHEMBL6228825 0.79 MEN1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2080784-B1 PROPYLENE RESIN COMPOSITION, METHOD FOR PRODUCING PROPYLENE RESIN COMPOSITION, PROPYLENE POLYMER COMPOSITION, MOLDED BODY MADE OF THE PROPYLENE RESIN COMPOSITION, AND ELECTRIC WIRE MITSUI CHEMICALS INC (JP) 2013-03-06 EP disclosed