SCHEMBL14744110

SCHEMBL14744110

CC(C)c1ccc(N)cc1-c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ANPEP P15144 1/20 0.44
ALDH1A1 P00352 4/20 0.42
NPC1 O15118 3/20 0.42
CYP3A4 P08684 3/20 0.42
TDP1 Q9NUW8 2/20 0.42
RAB9A P51151 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
TP53 P04637 1/20 0.42
TSHR P16473 1/20 0.42
MAPK1 P28482 1/20 0.42
MAOA P21397 1/20 0.42
PTGDR2 Q9Y5Y4 1/20 0.41
HSD17B10 Q99714 3/20 0.41
TAAR1 Q96RJ0 1/20 0.41
PTPRC P08575 2/20 0.41
KMT2A Q03164 2/20 0.41
MEN1 O00255 1/20 0.41
APAF1 O14727 1/20 0.41
TDP2 O95551 1/20 0.41
NSD2 O96028 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30792432 0.90 ANPEP (0.44) ANPEPALDH1A1NPC1CYP3A4TDP1
SCHEMBL9813433 0.90 ANPEP (0.44) ANPEPALDH1A1NPC1CYP3A4TDP1
SCHEMBL9813442 0.89 ANPEP (0.47) ANPEPALDH1A1NPC1CYP3A4TDP1
SCHEMBL30792455 0.89 ANPEP (0.47) ANPEPALDH1A1NPC1CYP3A4TDP1
SCHEMBL27656417 0.85 ANPEP (0.44) ANPEPALDH1A1NPC1CYP3A4TDP1
SCHEMBL9034484 0.81 USP7 (0.43) ANPEPALDH1A1CYP3A4SMN1; SMN2TP53
SCHEMBL10598465 0.80 MEN1 (0.47) NPC1RAB9ASMN1; SMN2KMT2AMEN1
SCHEMBL29239427 0.78 TRPA1 (0.48) PTGDR2LMNA
SCHEMBL3293062 0.78 LMNA (0.45) TSHRKMT2AMEN1LMNAHPGD
SCHEMBL1576728 0.77 CA12 (0.56) ALDH1A1MAPK1HSD17B10HPGDPPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117659932-A Polyamide-imide resin adhesive, preparation method thereof and temporary adhesive film for packaging semiconductor element 芜湖徽氏新材料科技有限公司 2024-03-08 CN claimed
CN-117659932-A Polyamide-imide resin adhesive, preparation method thereof and temporary adhesive film for packaging semiconductor element 芜湖徽氏新材料科技有限公司 2024-03-08 CN disclosed
WO-2013029338-A1 NOVEL COMPOUNDS GLAXO GROUP LIMITED (GB) 2013-03-07 WO disclosed