SCHEMBL1475007

SCHEMBL1475007

CC1=C([C]=O)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17258231 0.82
SCHEMBL17258226 0.80 ALDH1A1 (0.30)
SCHEMBL6063856 0.62
SCHEMBL9721883 0.55 NOS3 (0.38)
SCHEMBL9034976 0.53
SCHEMBL1311998 0.48 CYP3A4 (0.32)
SCHEMBL7981 0.47
SCHEMBL12113 0.47
SCHEMBL8461483 0.45 TRIM24 (0.38)
Hexamethylbenzene SCHEMBL6945522 0.45

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080213576-A1 CERAMIC SLURRY COMPOSITION, METHOD FOR PRODUCING THIN GREEN SHEET BY EXTRUSION, AND ELECTRONIC DEVICE FABRICATED USING THE GREEN SHEET SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2008-09-04 US claimed
US-7916450-B2 Ceramic slurry composition, method for producing thin green sheet by extrusion, and electronic device fabricated using the green sheet SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2011-03-29 US disclosed
US-20110065794-A1 Wrinkle-preventing and improving composition SHISEIDO COMPANY, LTD. (JP) 2011-03-17 US disclosed
US-20100168468-A1 WRINKLE-PREVENTING AND IMPROVING COMPOSITION KYOWA HAKKO KIRIN CO., LTD. (JP) 2010-07-01 US disclosed
US-20080213576-A1 CERAMIC SLURRY COMPOSITION, METHOD FOR PRODUCING THIN GREEN SHEET BY EXTRUSION, AND ELECTRONIC DEVICE FABRICATED USING THE GREEN SHEET SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2008-09-04 US disclosed
EP-1908454-A1 WRINKLE-PREVENTIVE/AMELIORATING AGENT SHISEIDO COMPANY, LTD. (JP) 2008-04-09 EP disclosed
US-20070249765-A1 Polymer Composition BOREALIS TECHNOLOGY OY (FI) 2007-10-25 US disclosed
US-20040259712-A1 Ceramic slurry composition, method for producing thin green sheet by extrusion, and electronic device fabricated using the green sheet SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2004-12-23 US disclosed