⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28616303 | 1.00 | — | — | |
| SCHEMBL1476838 | 1.00 | — | — | |
| SCHEMBL28620738 | 1.00 | — | — | |
| SCHEMBL1476172 | 1.00 | — | — | |
| SCHEMBL1475674 | 0.90 | — | — | |
| SCHEMBL6722145 | 0.90 | — | — | |
| SCHEMBL1476730 | 0.89 | CA2 (0.32) | — | |
| SCHEMBL19859739 | 0.89 | HSD17B10 (0.31) | — | |
| SCHEMBL12198792 | 0.89 | CA2 (0.32) | — | |
| SCHEMBL29652095 | 0.89 | HSD17B10 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6921454-B2 | Elastomer toughened radiation curable adhesives | HENKEL CORPORATION (US) | 2005-07-26 | — | — | US | claimed |
| US-6916890-B1 | Thermally reworkable epoxy resins and compositions based thereon | HENKEL CORPORATION (US) | 2005-07-12 | — | — | US | claimed |
| WO-2003046096-A1 | ELASTOMER TOUGHENED RADIATION CURABLE ADHESIVES | HENKEL CORPORATION (US) | 2003-06-05 | — | — | WO | claimed |
| US-20030100624-A1 | Elastomer toughened radiation curable adhesives | LOCTITE CORPORATION | 2003-05-29 | — | — | US | claimed |
| WO-2003031492-A1 | THERMALLY REWORKABLE EPOXY RESINS AND COMPOSITIONS BASED THEREO N | HENKEL CORPORATION (US) | 2003-04-17 | — | — | WO | claimed |
| CN-120005519-A | Curable composition for organic EL element sealing agent, cured film, organic EL element, and method for producing same | JSR株式会社 | 2025-05-16 | — | — | CN | disclosed |
| WO-2021070491-A1 | PHOTOCURABLE COMPOSITION FOR NANOIMPRINTING | サンアプロ株式会社 | 2021-04-15 | — | — | WO | disclosed |
| US-7915524-B2 | Sealing agent for photoelectric conversion device and photoelectric conversion device using the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2011-03-29 | — | — | US | disclosed |
| US-7271219-B2 | Useful as overcoating materials and interlayer insulating materials for wiring boards | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-09-18 | — | — | US | disclosed |
| US-20060162771-A1 | Sealing agent for photoelectric conversion element and photoelectric conversion device element using the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2006-07-27 | — | — | US | disclosed |
| US-7009009-B1 | Fluxing underfill compositions | HENKEL CORPORATION (US) | 2006-03-07 | — | — | US | disclosed |
| EP-1598897-A1 | SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME | Nippon Kayaku Kabushiki Kaisha (JP) | 2005-11-23 | — | — | EP | disclosed |
| US-20030100624-A1 | Elastomer toughened radiation curable adhesives | LOCTITE CORPORATION | 2003-05-29 | — | — | US | disclosed |
| WO-2003031492-A1 | THERMALLY REWORKABLE EPOXY RESINS AND COMPOSITIONS BASED THEREO N | HENKEL CORPORATION (US) | 2003-04-17 | — | — | WO | disclosed |
| US-6417243-B1 | POLYESTERURETHANE BLOCKS | UCB, S.A. (BE) | 2002-07-09 | — | — | US | disclosed |
| US-6210790-B1 | TRANSPARENCY, HARDNESS, ABRASION-RESISTANCE | RENSSELAER POLYTECHNIC INSTITUTE | 2001-04-03 | — | — | US | disclosed |
| US-5639413-A | THREE-DIMENSIONAL OBJETS; USING AN EPOXY-FUNCTIONAL SILICON CONTAINING MONOMER | CRIVELLO JAMES VINCENT (US) | 1997-06-17 | — | — | US | disclosed |
| US-5567858-A | COATINGS, SEAL, VARNISHES, ADHESIVES | RENSSELAER POLYTECHNIC INSTITUTE (US) | 1996-10-22 | — | — | US | disclosed |
| WO-1996030182-A1 | METHODS AND COMPOSITIONS RELATED TO STEREOLITHOGRAPHY | CRIVELLO JAMES V (US) | 1996-10-03 | — | — | WO | disclosed |
| US-5486545-A | SOLVENT RESISTANCE | RENSSELAER POLYTECHNIC INSTITUTE (US) | 1996-01-23 | — | — | US | disclosed |