SCHEMBL1476838

SCHEMBL1476838

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nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28616303 1.00
SCHEMBL28620738 1.00
SCHEMBL1476660 1.00
SCHEMBL1476172 1.00
SCHEMBL1475674 0.90
SCHEMBL6722145 0.90
SCHEMBL1476730 0.89 CA2 (0.32)
SCHEMBL19859739 0.89 HSD17B10 (0.31)
SCHEMBL12198792 0.89 CA2 (0.32)
SCHEMBL29652095 0.89 HSD17B10 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6921454-B2 Elastomer toughened radiation curable adhesives HENKEL CORPORATION (US) 2005-07-26 US claimed
WO-2003046096-A1 ELASTOMER TOUGHENED RADIATION CURABLE ADHESIVES HENKEL CORPORATION (US) 2003-06-05 WO claimed
US-20030100624-A1 Elastomer toughened radiation curable adhesives LOCTITE CORPORATION 2003-05-29 US claimed
US-6030703-A SUITABLE FOR FREE RADICAL, RADIATION CURABLE COATING SARTOMER COMPANY, INC. (US) 2000-02-29 US claimed
US-7915524-B2 Sealing agent for photoelectric conversion device and photoelectric conversion device using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2011-03-29 US disclosed
US-7271219-B2 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2007-09-18 US disclosed
US-20060162771-A1 Sealing agent for photoelectric conversion element and photoelectric conversion device element using the same NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2006-07-27 US disclosed
EP-1598897-A1 SEALING AGENT FOR PHOTOELECTRIC CONVERSION ELEMENT AND PHOTOELECTRIC CONVERSION ELEMENT USING THE SAME Nippon Kayaku Kabushiki Kaisha (JP) 2005-11-23 EP disclosed
US-6921454-B2 Elastomer toughened radiation curable adhesives HENKEL CORPORATION (US) 2005-07-26 US disclosed
EP-0931103-B1 MONOMERS, OLIGOMERS AND POLYMERS WITH TERMINAL OXIRANE GROUPS, METHOD OF PREPARATION AND POLYMERISATION UNDER RADIATION EXPOSURE UCB SA (BE) 2004-06-09 EP disclosed
US-20040102601-A1 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-05-27 US disclosed
EP-1375553-A1 CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-02 EP disclosed
US-6417243-B1 POLYESTERURETHANE BLOCKS UCB, S.A. (BE) 2002-07-09 US disclosed
EP-1002018-A2 RADIATION CURABLE COMPOSITIONS SARTOMER COMPANY INC. (US) 2000-05-24 EP disclosed
US-6030703-A SUITABLE FOR FREE RADICAL, RADIATION CURABLE COATING SARTOMER COMPANY, INC. (US) 2000-02-29 US disclosed
EP-0931103-A1 MONOMERS, OLIGOMERS AND POLYMERS WITH TERMINAL OXIRANE GROUPS, METHOD OF PREPARATION AND POLYMERISATION UNDER RADIATION EXPOSURE UCB, S.A. (BE) 1999-07-28 EP disclosed
WO-1999006463-A2 RADIATION CURABLE POLYESTER COMPOSITIONS SARTOMER COMPANY, INC. (US) 1999-02-11 WO disclosed
WO-1998014497-A1 MONOMERS, OLIGOMERS AND POLYMERS WITH TERMINAL OXIRANE GROUPS, METHOD OF PREPARATION AND POLYMERISATION UNDER RADIATION EXPOSURE UCB, S.A. (BE) 1998-04-09 WO disclosed
US-5567858-A COATINGS, SEAL, VARNISHES, ADHESIVES RENSSELAER POLYTECHNIC INSTITUTE (US) 1996-10-22 US disclosed
US-5486545-A SOLVENT RESISTANCE RENSSELAER POLYTECHNIC INSTITUTE (US) 1996-01-23 US disclosed