SCHEMBL1476974

SCHEMBL1476974

[CH2]CC1CC2C=CC1C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1477558 0.81 KDM4E (0.43)
SCHEMBL1012047 0.79 KDM4E (0.48)
SCHEMBL4445948 0.79 KDM4E (0.48)
SCHEMBL1478459 0.78 KDM4E (0.41)
Ethylene SCHEMBL9419360 0.76 KDM4E (0.52)
SCHEMBL13443159 0.75
SCHEMBL201785 0.75
SCHEMBL11221958 0.75
SCHEMBL20721709 0.75
SCHEMBL11713670 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6252101-B1 ADDITION-CONDENSATION POLYMER WACKER-CHEMIE GMBH (DE) 2001-06-26 US claimed
US-4166083-A DIENE RUBBER BLEND WITH A NORBORNENE-CONTAINING POLYMER NIPPON ZEON CO. LTD. (JP) 1979-08-28 US claimed
CN-116745332-A Resin composition 日本瑞翁株式会社 2023-09-12 CN disclosed
US-20230141280-A1 SILICONE RUBBER FORMULATIONS COMPRISING SILOXANES BEARING ALICYCLIC SIDE CHAIN GROUPS APPLE INC. 2023-05-11 US disclosed
WO-2023032724-A1 LOW DIELECTRIC CONSTANT INSULATING COATING COMPOSITION, CURED PRODUCT OF SAME AND DISPLAY DEVICE 信越化学工業株式会社 2023-03-09 WO disclosed
CN-110240907-B Etching solution for selectively removing silicon-germanium alloy from silicon-germanium/germanium stack during semiconductor device fabrication 弗萨姆材料美国有限责任公司 2021-09-17 CN disclosed
CN-111197182-A Etching solution with silicon oxide corrosion inhibitor and method of use thereof 弗萨姆材料美国有限责任公司 2020-05-26 CN disclosed
CN-104039835-B Containing having carried out the composition of 4-oxo-2,2,6,6-tetramethyl piperidine-1-oxygen base of stabilization, the stopper composition of vinyl compound and used the anti-polymerization method of its vinyl compound 伯东株式会社 2016-06-08 CN disclosed
US-9261781-B2 Preparation of norbornane-based PAC ballasts SUMITOMO BAKELITE CO., LTD. (JP) 2016-02-16 US disclosed
CN-102947260-B Polymerization inhibitor composition for vinyl compounds and method for inhibiting the polymerization of vinyl compounds which includes using same HAKUTO KK 2015-03-25 CN disclosed
CN-104039835-A STABILIZED 4-OXO-2,2,6,6-TETRAMETHYLPIPERIDINE-1-OXYL-CONTAINING COMPOSITION, POLYMERIZATION INHIBITOR COMPOSITION FOR VINYL COMPOUND, AND METHOD FOR INHIBITING POLYMERIZATION OF VINYL COMPOUND USING SAME HAKUTO KK 2014-09-10 CN disclosed
EP-0940405-B1 Organosilicon compounds containing alkenyl groups WACKER CHEMIE GMBH (DE) 2002-03-13 EP disclosed
US-6252101-B1 ADDITION-CONDENSATION POLYMER WACKER-CHEMIE GMBH (DE) 2001-06-26 US disclosed
EP-0940405-A1 Organosilicon compounds containing alkenyl groups Wacker-Chemie GmbH (DE) 1999-09-08 EP disclosed
US-5266670-A Reaction of norbornene compound with silane and hydrosilation LOCTITE CORPORATION (US) 1993-11-30 US disclosed
US-5171816-A Curable by hydrosilation in presence of polymerization catalyst LOCTITE CORPORATION (US) 1992-12-15 US disclosed
US-5034490-A Silicones with norbornene groups and thiol groups to cure by hydrosilation LOCTITE CORPORATION (US) 1991-07-23 US disclosed
EP-0388005-A2 Selective monohydrosilation of vinyl and ethynyl functional norbornenes and curable products produced thereby LOCTITE CORPORATION (US) 1990-09-19 EP disclosed
EP-0388028-A2 Curable norbornenyl functional silicone formulations LOCTITE CORPORATION (US) 1990-09-19 EP disclosed
US-4166083-A DIENE RUBBER BLEND WITH A NORBORNENE-CONTAINING POLYMER NIPPON ZEON CO. LTD. (JP) 1979-08-28 US disclosed