SCHEMBL1477054

SCHEMBL1477054

C1=CC2CCC1C2.CCCCCCCC/C=C\CCCCCCC(C)C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 1/20 0.48
PPARG P37231 5/20 0.42
PPARD Q03181 5/20 0.42
PPARA Q07869 5/20 0.42
ALDH1A1 P00352 4/20 0.42
F7 P08709 4/20 0.42
F3 P13726 4/20 0.42
FABP4 P15090 3/20 0.42
HSD17B10 Q99714 3/20 0.42
FFAR1 O14842 2/20 0.42
FFAR4 Q5NUL3 2/20 0.42
DUSP3 P51452 2/20 0.42
PTPN7 P35236 2/20 0.42
LMNA P02545 2/20 0.42
CYP19A1 P11511 2/20 0.42
ALOX15 P16050 2/20 0.42
PTGS1 P23219 2/20 0.42
NR4A2 P43354 2/20 0.42
SIRT6 Q8N6T7 2/20 0.42
TDP1 Q9NUW8 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1477158 0.92 ACE2 (0.56) ACE2PPARDFFAR1FFAR4MAPT
SCHEMBL1477507 0.92 ACE2 (0.56) ACE2PPARDFFAR1FFAR4MAPT
SCHEMBL1477205 0.92 ACE2 (0.56) ACE2PPARDFFAR1FFAR4MAPT
SCHEMBL1476651 0.92 ACE2 (0.56) ACE2PPARDFFAR1FFAR4MAPT
SCHEMBL1477224 0.90 ALDH1A1 (0.47) PPARGPPARDPPARAALDH1A1F7
SCHEMBL1477469 0.86 ACE2 (0.46) ACE2FFAR1MAPTBLMCYP1A2
SCHEMBL18955451 0.84 ACE2 (0.65) ACE2PPARGPPARDPPARAF7
SCHEMBL6432220 0.84 ACE2 (0.65) ACE2PPARGPPARDPPARAF7
SCHEMBL1647192 0.84 ACE2 (0.65) ACE2PPARGPPARDPPARAF7
SCHEMBL22772992 0.84 ACE2 (0.65) ACE2PPARGPPARDPPARAF7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7915467-B2 layer contains a cyclic olefin resin having an epoxy group and a photoacid generator; low stress properties and adhesion; prevent breakage of the semiconductor wafer in a process for grinding the backside to make them thinner SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-03-29 US disclosed
US-7808083-B2 Semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-10-05 US disclosed
US-20100120937-A1 SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-05-13 US disclosed
US-20080277805-A1 Semiconductor Device SUMITOMO BAKELITE CO., LTD. (JP) 2008-11-13 US disclosed
US-20080090176-A1 Semiconductor Wafer And Semiconductor Device SUMITOMO BAKELITE CO., LTD. (JP) 2008-04-17 US disclosed
EP-1804291-A1 SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-07-04 EP disclosed
EP-1801872-A1 SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-06-27 EP disclosed