SCHEMBL14826285

SCHEMBL14826285

C=CC(=O)OCCCCOc1ccc(C(=O)Oc2ccc(OC(=O)c3ccc(OCCOc4ccc(B(O)O)cc4)cc3)c(C)c2C)cc1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ THRB P10828 1/20 0.43
▸ HTT P42858 3/20 0.39
▸ MAPT P10636 3/20 0.39
▸ KMT2A Q03164 1/20 0.38
▸ TSHR P16473 2/20 0.37
▸ HPGD P15428 1/20 0.37
▸ TDP1 Q9NUW8 3/20 0.37
▸ L3MBTL1 Q9Y468 3/20 0.37
▸ CYP3A4 P08684 2/20 0.37
▸ NPC1 O15118 2/20 0.37
▸ LMNA P02545 2/20 0.37
▸ ALDH1A1 P00352 1/20 0.37
▸ POLB P06746 1/20 0.37
▸ APEX1 P27695 1/20 0.37
▸ CYP1A2 P05177 1/20 0.37
▸ CYP2D6 P10635 1/20 0.37
▸ CYP2C9 P11712 1/20 0.37
▸ CYP2C19 P33261 1/20 0.37
▸ NFKB1 P19838 1/20 0.36
▸ NFKB2 Q00653 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19295720 0.98 THRB (0.41) THRBHTTMAPTKMT2ATSHR
SCHEMBL19295711 0.97 NPC1 (0.41) THRBHTTMAPTKMT2ATSHR
SCHEMBL19295737 0.97 NPC1 (0.41) THRBHTTMAPTKMT2ATSHR
SCHEMBL17833478 0.94 THRB (0.38) THRBHTTMAPTKMT2ATSHR
SCHEMBL16945726 0.94 THRB (0.38) THRBHTTMAPTKMT2ATSHR
SCHEMBL19295723 0.92 HTT (0.38) THRBHTTMAPTKMT2ATSHR
SCHEMBL19295727 0.92 NPC1 (0.38) THRBHTTMAPTKMT2ACYP3A4
SCHEMBL19295714 0.92 NPC1 (0.38) THRBHTTMAPTKMT2ACYP3A4
SCHEMBL14750349 0.90 THRB (0.39) THRBHTTMAPTKMT2ATSHR
SCHEMBL15523698 0.90 HTT (0.47) THRBHTTMAPTKMT2ATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10774212-B2 Thermally conductive material, resin composition, and device FUJIFILM CORPORATION (JP) 2020-09-15 — — US disclosed
US-10752778-B2 Resin composition containing surface-modified inorganic substance, thermally conductive material, and device FUJIFILM CORPORATION (JP) 2020-08-25 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
US-20130083277-A1 OPTICAL FILM, LIQUID CRYSTAL DISPLAY, TRANSFERRING MATERIAL, AND METHOD OF MANUFACTURING OPTICAL FILM FUJIFILM CORPORATION (JP) 2013-04-04 — — US disclosed
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