SCHEMBL19295737

SCHEMBL19295737

C=CC(=O)OCCCCOc1ccc(C(=O)Oc2ccc(OC(=O)c3ccc(C(=O)Oc4ccc(B(O)O)cc4)cc3)c(C)c2C)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ NPC1 O15118 2/20 0.41
▸ LMNA P02545 2/20 0.41
▸ CYP3A4 P08684 2/20 0.41
▸ CYP1A2 P05177 1/20 0.41
▸ CYP2D6 P10635 1/20 0.41
▸ CYP2C9 P11712 1/20 0.41
▸ CYP2C19 P33261 1/20 0.41
▸ MAPT P10636 5/20 0.40
▸ KMT2A Q03164 3/20 0.40
▸ THRB P10828 2/20 0.40
▸ NFKB1 P19838 1/20 0.40
▸ NFKB2 Q00653 1/20 0.40
▸ RELA Q04206 1/20 0.40
▸ SMN1; SMN2 Q16637 1/20 0.40
▸ PRSS1 P07477 1/20 0.39
▸ ACR P10323 1/20 0.39
▸ HTT P42858 3/20 0.38
▸ TSHR P16473 2/20 0.36
▸ HPGD P15428 2/20 0.36
▸ POLB P06746 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19295711 1.00 NPC1 (0.41) NPC1LMNACYP3A4CYP1A2CYP2D6
SCHEMBL14826285 0.97 THRB (0.43) NPC1LMNACYP3A4CYP1A2CYP2D6
SCHEMBL19295720 0.97 THRB (0.41) NPC1LMNACYP3A4CYP1A2CYP2D6
SCHEMBL19295714 0.95 NPC1 (0.38) NPC1LMNACYP3A4CYP1A2CYP2D6
SCHEMBL19295727 0.95 NPC1 (0.38) NPC1LMNACYP3A4CYP1A2CYP2D6
SCHEMBL19295723 0.93 HTT (0.38) NPC1LMNACYP3A4CYP1A2CYP2D6
SCHEMBL17833478 0.93 THRB (0.38) NPC1MAPTKMT2ATHRBSMN1; SMN2
SCHEMBL16945726 0.93 THRB (0.38) NPC1MAPTKMT2ATHRBSMN1; SMN2
SCHEMBL14750352 0.92 THRB (0.47) NPC1LMNACYP3A4CYP1A2CYP2D6
SCHEMBL17929708 0.92 THRB (0.47) NPC1LMNACYP3A4CYP1A2CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10774212-B2 Thermally conductive material, resin composition, and device FUJIFILM CORPORATION (JP) 2020-09-15 — — US disclosed
US-10752778-B2 Resin composition containing surface-modified inorganic substance, thermally conductive material, and device FUJIFILM CORPORATION (JP) 2020-08-25 — — US disclosed
US-10294372-B2 Surface-modified inorganic substance, method for manufacturing surface-modified inorganic substance, method for modifying surface of inorganic substance with organic substance, heat dissipation material, thermally conductive material, and lubricant FUJIFILM CORPORATION (JP) 2019-05-21 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
US-20170247546-A1 SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC SUBSTANCE, METHOD FOR MODIFYING SURFACE OF INORGANIC SUBSTANCE WITH ORGANIC SUBSTANCE, HEAT DISSIPATION MATERIAL, THERMALLY CONDUCTIVE MATERIAL, AND LUBRICANT FUJIFILM CORPORATION (JP) 2017-08-31 — — US disclosed
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