Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOB | P27338 | 3/20 | 0.63 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.55 |
| ▸ | MAPT | P10636 | 2/20 | 0.55 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.55 |
| ▸ | MEN1 | O00255 | 2/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.55 |
| ▸ | MITF | O75030 | 1/20 | 0.55 |
| ▸ | GAA | P10253 | 1/20 | 0.55 |
| ▸ | GFER | P55789 | 1/20 | 0.55 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.55 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.55 |
| ▸ | LTA4H | P09960 | 1/20 | 0.49 |
| ▸ | ATM | Q13315 | 1/20 | 0.47 |
| ▸ | POLB | P06746 | 1/20 | 0.47 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.47 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.47 |
| ▸ | APP | P05067 | 1/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.46 |
| ▸ | TP53 | P04637 | 1/20 | 0.46 |
| ▸ | ST14 | Q9Y5Y6 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29363434 | 1.00 | MAOB (0.63) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL7866558 | 0.96 | MAOB (0.63) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL308892 | 0.93 | MAOB (0.68) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL29363121 | 0.93 | MAOB (0.68) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL8542739 | 0.90 | MAOB (0.56) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL2785192 | 0.89 | ALDH1A1 (0.66) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL29049897 | 0.87 | MAOB (0.56) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL3151082 | 0.86 | MAOB (0.59) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL307492 | 0.85 | MAOB (0.68) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL9248858 | 0.85 | MAOB (0.68) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 229 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0313407-B1 | Method for preparing polyimide and composite material thereof | MITSUI TOATSU CHEMICALS (JP) | 1996-05-08 | — | — | EP | claimed |
| EP-4029690-B1 | METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2026-04-22 | — | — | EP | disclosed |
| US-12479194-B2 | Laminate | TOYOBO CO., LTD. (JP) | 2025-11-25 | — | — | US | disclosed |
| US-12472732-B2 | Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device | TOYOBO CO., LTD. (JP) | 2025-11-18 | — | — | US | disclosed |
| US-12391813-B2 | Layered body including inorganic substrate and polyamic acid cured product | TOYOBO CO., LTD. (JP) | 2025-08-19 | — | — | US | disclosed |
| WO-2025070767-A1 | RESIN COMPOSITION, COATING SOLUTION, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| WO-2025070797-A1 | COPOLYMER, RESIN BASE MATERIAL, RESIN COMPOSITION, COATING LIQUID, POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, AND MANUFACTURING METHOD | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| WO-2025063274-A1 | POLYIMIDE RESIN-CONTAINING COMPOSITION AND CURED PRODUCT THEREOF | 日本化薬株式会社 | 2025-03-27 | — | — | WO | disclosed |
| WO-2025047667-A1 | SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL | 東洋紡株式会社 | 2025-03-06 | — | — | WO | disclosed |
| US-20250019508-A1 | LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT | TOYOBO CO., LTD. (JP) | 2025-01-16 | — | — | US | disclosed |
| EP-0661347-A1 | Polyimide resin composition having excellent fatigue resistance and injection molded article of same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1995-07-05 | — | — | EP | disclosed |
| US-5406124-A | Thermoplastic polyimides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1995-04-11 | — | — | US | disclosed |
| US-5374469-A | Using thermoplastic polyimide resin showing adhesive properties by press bending by heating, using low-linear expansion polyimide | NITTO DENKO CORPORATION (JP) | 1994-12-20 | — | — | US | disclosed |
| EP-0605112-A2 | Insulating adhesive tape, and lead frame and semiconductor device employing the tape | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1994-07-06 | — | — | EP | disclosed |
| US-5321096-A | Good processability and heat stability | MITSUI TOATSU CHEMICAL, INCORPORATED (JP) | 1994-06-14 | — | — | US | disclosed |
| EP-0564299-A2 | Polyimide composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-10-06 | — | — | EP | disclosed |
| EP-0533198-A2 | Flexible printed substrate | NITTO DENKO CORPORATION (JP) | 1993-03-24 | — | — | EP | disclosed |
| US-4960852-A | IMPACT STRENGTH, FLEXIBILITY, HEAT RESISTANCE; MOLDING MATERIALS | MITSUI TOATSU CHEMICALS, INC. (JP) | 1990-10-02 | — | — | US | disclosed |
| EP-0342912-A1 | Thermosetting resin compositions | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1989-11-23 | — | — | EP | disclosed |
| EP-0294195-A2 | Polyimide resin composition | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1988-12-07 | — | — | EP | disclosed |