SCHEMBL308892

SCHEMBL308892

Nc1cccc(Oc2ccc(CCc3ccc(Oc4cccc(N)c4)cc3)cc2)c1

nearest known ligand 0.77

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 4/20 0.68
ALDH1A1 P00352 4/20 0.59
MAPT P10636 2/20 0.59
SMN1; SMN2 Q16637 2/20 0.59
MEN1 O00255 1/20 0.59
MITF O75030 1/20 0.59
GAA P10253 1/20 0.59
GFER P55789 1/20 0.59
KMT2A Q03164 1/20 0.59
NLRP1 Q9C000 1/20 0.59
NOD2 Q9HC29 1/20 0.59
CYP19A1 P11511 1/20 0.55
MAOA P21397 2/20 0.52
LTA4H P09960 1/20 0.51
ATM Q13315 1/20 0.50
POLB P06746 1/20 0.50
HSP90AA1 P07900 1/20 0.50
APP P05067 1/20 0.49
CYP3A4 P08684 2/20 0.48
TP53 P04637 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29363121 1.00 MAOB (0.68) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL2785192 0.96 ALDH1A1 (0.66) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29363434 0.93 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL7866558 0.93 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL1482835 0.93 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29049897 0.90 MAOB (0.56) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL3151082 0.90 MAOB (0.59) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL307492 0.89 MAOB (0.68) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29364255 0.89 MAOB (0.68) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL9248858 0.89 MAOB (0.68) MAOBALDH1A1MAPTSMN1; SMN2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 459 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7803896-B2 Polyimide-titania hybrid materials, their preparation, and film prepared from the materials NATIONAL TAIWAN UNIVERSITY (TW) 2010-09-28 US claimed
US-20090092759-A1 Polyimide-titania hybrid materials, their preparation, and film prepared from the materials NATIONAL TAIWAN UNIVERSITY (TW) 2009-04-09 US claimed
US-5278276-A Polyamic acid precursor; prepared from bis/aminophenoxyphenyl/ compounds and tetracarboxylic acid dianhydrides MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-01-11 US claimed
US-12479194-B2 Laminate TOYOBO CO., LTD. (JP) 2025-11-25 US disclosed
US-12472732-B2 Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device TOYOBO CO., LTD. (JP) 2025-11-18 US disclosed
US-12391813-B2 Layered body including inorganic substrate and polyamic acid cured product TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
WO-2025047667-A1 SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL 東洋紡株式会社 2025-03-06 WO disclosed
US-20250019508-A1 LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT TOYOBO CO., LTD. (JP) 2025-01-16 US disclosed
US-12172409-B2 Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method TOYOBO CO., LTD. (JP) 2024-12-24 US disclosed
US-20240395547-A1 SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS UNIVERSITY OF TSUKUBA (JP) 2024-11-28 US disclosed
US-20240375381-A1 TRANSPARENT HEAT-RESISTANT LAMINATED FILM TOYOBO CO., LTD. (JP) 2024-11-14 US disclosed
EP-0294931-A1 Self-lubricating thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-14 EP disclosed
EP-0294195-A2 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-07 EP disclosed
EP-0294144-A1 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-07 EP disclosed
EP-0292243-A2 Heat resistant resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-11-23 EP disclosed
EP-0288251-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-10-26 EP disclosed
EP-0269319-A2 Polyimide MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-06-01 EP disclosed
EP-0253586-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-20 EP disclosed
EP-0251741-A2 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-07 EP disclosed
EP-0235294-A1 POLYIMIDES AND HEAT-RESISTANT ADHESIVES COMPRISING THE SAME MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-09-09 EP disclosed