SCHEMBL1485969

SCHEMBL1485969

CCOOC(=O)C(CC)OCC

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.33
LMNA P02545 1/20 0.32
HSD17B10 Q99714 1/20 0.32
ALOX15 P16050 1/20 0.31
MGAM O43451 1/20 0.31
GAA P10253 1/20 0.31
SI P14410 1/20 0.31
MGAM2 Q2M2H8 1/20 0.31
SOAT1 P35610 1/20 0.31
THRB P10828 1/20 0.31
PPARA Q07869 2/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27343674 0.83 CHRM1 (0.32) ALDH1A1LMNAHSD17B10PPARA
SCHEMBL2802401 0.83 ALDH1A1 (0.39) ALDH1A1LMNAPPARASMN1; SMN2
SCHEMBL1485971 0.83 ALDH1A1 (0.33) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL27566942 0.80 CA2 (0.39) ALDH1A1
SCHEMBL249492 0.79 SOAT1 (0.40) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL3284678 0.79 ALDH1A1 (0.43) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL11217413 0.77 ALDH1A1 (0.36) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL12072072 0.77 CA1 (0.42) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL22775383 0.77 ALDH1A1 (0.36) ALDH1A1LMNAHSD17B10ALOX15MGAM
SCHEMBL7058932 0.76 ALDH1A1 (0.35) ALDH1A1LMNAHSD17B10ALOX15MGAM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0077221-A1 Water-borne hermetic varnish SCHENECTADY CHEMICALS INC. (US) 1983-04-20 EP claimed
US-9972413-B2 Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate DAI NIPPON PRINTING CO., LTD. (JP) 2018-05-15 US disclosed
US-9953740-B2 Dispersant, metal particle dispersion for electroconductive substrates, and method for producing electroconductive substrate DAI NIPPON PRINTING CO., LTD. (JP) 2018-04-24 US disclosed
US-9751997-B2 Metal particle dispersion, article and sintered film using metal particle dispersion, and method for producing sintered film DAI NIPPON PRINTING CO., LTD. (JP) 2017-09-05 US disclosed
EP-2905313-B1 METAL PARTICLE DISPERSION, ARTICLE AND SINTERED FILM USING METAL PARTICLE DISPERSION, AND METHOD FOR PRODUCING SINTERED FILM DAINIPPON PRINTING CO LTD (JP) 2017-05-03 EP disclosed
US-9625615-B2 Non-aqueous dispersant, color material dispersion liquid and method for producing the same, color resin composition and method for producing the same, color filter, liquid crystal display device, and organic light-emitting display device DAI NIPPON PRINTING CO., LTD. (JP) 2017-04-18 US disclosed
US-20150299364-A1 DISPERSANT, METAL PARTICLE DISPERSION FOR ELECTROCONDUCTIVE SUBSTRATES, AND METHOD FOR PRODUCING ELECTROCONDUCTIVE SUBSTRATE DAI NIPPON PRINTING CO., LTD (JP) 2015-10-22 US disclosed
US-20150279505-A1 METAL PARTICLE DISPERSION FOR ELECTROCONDUCTIVE SUBSTRATES, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRODUCING AN ELECTROCONDUCTIVE SUBSTRATE DAI NIPPON PRINTING CO., LTD. (JP) 2015-10-01 US disclosed
US-20150252157-A1 METAL PARTICLE DISPERSION, ARTICLE AND SINTERED FILM USING METAL PARTICLE DISPERSION, AND METHOD FOR PRODUCING SINTERED FILM DAI NIPPON PRINTING CO., LTD. (JP) 2015-09-10 US disclosed
EP-2905313-A1 METAL PARTICLE DISPERSION, ARTICLE AND SINTERED FILM USING METAL PARTICLE DISPERSION, AND METHOD FOR PRODUCING SINTERED FILM Dai Nippon Printing Co., Ltd. (JP) 2015-08-12 EP disclosed
EP-1076070-B1 Highly stable resin, hardenable resin composition, production method therefor, color filter and liquid crystal panel DAINIPPON PRINTING CO LTD (JP) 2007-04-04 EP disclosed
CN-1914783-A Graphitic brush, and motor having graphitic brush AISIN SEIKI (JP) 2007-02-14 CN disclosed
EP-1141063-B1 HIGH PHOTO-SENSITIVITY CURABLE RESIN, PHOTO-CURABLE RESIN COMPOSITION, PRODUCTION METHOD THEREOF, COLOR FILTER AND LIQUID CRYSTAL DISPLAY PANEL DAINIPPON PRINTING CO LTD (JP) 2006-12-13 EP disclosed
US-20060229376-A1 Curable resin composition, photosensitive pattern-forming curable resin composition,color filter, substrate for liquid crystalline panel, and liquid crystalline panel DAI NIPPON PRINTING CO., LTD. (JP) 2006-10-12 US disclosed
US-20060098316-A1 Green pigment for color filter, green pigment dispersion, photosensitive color composition, color filter, and liquid crystal panel DIC CORPORATION (JP) 2006-05-11 US disclosed
CN-1656398-A Photocurable resin composition for forming overcoats, rgb pixels, black matrixes or spacers in color filter production, and color filters DAINIPPON PRINTING CO LTD (JP) 2005-08-17 CN disclosed
US-6582862-B1 Curable resin comprising polymer having main chain comprising constitutional unit having acid group and one having hydroxyl group, wherein isocyanate compound containing radical polymerizable group is bonded with acid and/or hydroxy groups DAI NIPPON PRINTING CO., LTD. (JP) 2003-06-24 US disclosed
EP-1141063-A1 HIGH PHOTO-SENSITIVITY CURABLE RESIN, PHOTO-CURABLE RESIN COMPOSITION, PRODUCTION METHOD THEREOF, COLOR FILTER AND LIQUID CRYSTAL DISPLAY PANEL DAI NIPPON PRINTING CO., LTD. (JP) 2001-10-10 EP disclosed
WO-2001027182-A1 HIGH PHOTO-SENSITIVITY CURABLE RESIN, PHOTO-CURABLE RESIN COMPOSITION, PRODUCTION METHOD THEREOF, COLOR FILTER AND LIQUID CRYSTAL DISPLAY PANEL DAI NIPPON PRINTING CO., LTD. (JP) 2001-04-19 WO disclosed
EP-1076070-A2 Highly stable resin, hardenable resin composition, production method therefor, color filter and liquid crystal panel DAI NIPPON PRINTING CO., LTD. (JP) 2001-02-14 EP disclosed