⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28791934 | 1.00 | — | — | |
| SCHEMBL221057 | 0.97 | — | — | |
| SCHEMBL31672170 | 0.94 | — | — | |
| SCHEMBL28693375 | 0.84 | HPGD (0.39) | — | |
| Propionitrile SCHEMBL11870717 | 0.82 | ALDH1A1 (0.38) | — | |
| SCHEMBL28656731 | 0.81 | — | — | |
| SCHEMBL28560676 | 0.80 | FAAH (0.48) | — | |
| SCHEMBL28558022 | 0.80 | FAAH (0.48) | — | |
| SCHEMBL28555439 | 0.80 | FAAH (0.48) | — | |
| SCHEMBL28561664 | 0.80 | FAAH (0.48) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116516424-A | Manufacturing method of continuous high-tensile electrolytic copper foil | 九江德福科技股份有限公司 | 2023-08-01 | — | — | CN | claimed |
| CN-115369459-A | Copper electroplating solution and copper electroplating process thereof | 深圳市中科博美新材料科技有限公司 | 2022-11-22 | — | — | CN | claimed |
| CN-110424013-B | Plastic product surface metallization method and product | 广东硕成科技股份有限公司 | 2022-05-31 | — | — | CN | claimed |
| CN-114351190-A | Preparation method of additive for flexible copper clad laminate electrolytic copper foil, product and application thereof | 安徽华威铜箔科技有限公司 | 2022-04-15 | — | — | CN | claimed |
| CN-112516673-A | Slurry coating process of diatomite filter for lithium electro-copper foil system | 灵宝华鑫铜箔有限责任公司 | 2021-03-19 | — | — | CN | claimed |
| US-7588675-B2 | Iron-phosphorus electroplating bath and method | ATOTECH DEUTSCHLAND GMBH (DE) | 2009-09-15 | — | — | US | claimed |
| US-20090101515-A1 | IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2009-04-23 | — | — | US | claimed |
| CN-118241268-A | High tensile strength electrolytic copper foil additive, electrolytic copper foil and preparation method | 陕西未来尖端材料科技有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-117800882-A | Preparation method of 3-mercaptopropane sodium sulfonate | 湖北吉和昌化工科技有限公司 | 2024-04-02 | — | — | CN | disclosed |
| CN-116516424-A | Manufacturing method of continuous high-tensile electrolytic copper foil | 九江德福科技股份有限公司 | 2023-08-01 | — | — | CN | disclosed |
| US-11566339-B2 | Plating method and plating apparatus | EBARA CORPORATION (JP) | 2023-01-31 | — | — | US | disclosed |
| CN-115611791-A | Preparation method of sodium polydithio-dipropyl sulfonate | 湖北吉和昌化工科技有限公司 | 2023-01-17 | — | — | CN | disclosed |
| CN-115369459-A | Copper electroplating solution and copper electroplating process thereof | 深圳市中科博美新材料科技有限公司 | 2022-11-22 | — | — | CN | disclosed |
| US-7494578-B2 | Iron-phosphorus electroplating bath and method | ATOTECH DEUTSCHLAND GMBH (DE) | 2009-02-24 | — | — | US | disclosed |
| EP-1721029-A2 | IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD | ATOTECH DEUTSCHLAND GMBH (DE) | 2006-11-15 | — | — | EP | disclosed |
| WO-2005093134-A2 | IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD | ATOTECH DEUTSCHLAND GMBH (DE) | 2005-10-06 | — | — | WO | disclosed |
| US-20050189232-A1 | Iron-phosphorus electroplating bath and method | ATOTECH USA, LLC | 2005-09-01 | — | — | US | disclosed |
| WO-2004016376-A1 | METAL NANOCRYSTALS AND SYNTHESIS THEREOF | NANOSPIN SOLUTIONS (US) | 2004-02-26 | — | — | WO | disclosed |
| US-6645444-B2 | Complex of metal and ligand; using reducing agent; catalyst | NANOSPIN SOLUTIONS | 2003-11-11 | — | — | US | disclosed |
| US-20030008145-A1 | Complex of metal and ligand; using reducing agent; catalyst | FARDEEN, JAMES | 2003-01-09 | — | — | US | disclosed |