SCHEMBL14944906

SCHEMBL14944906

CCCCCCCc1c(CCCCC)ccc(CCCCCCCCC(=O)O)c1CCCCCCCCC(=O)O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SCD O00767 1/20 0.59
GPR84 Q9NQS5 7/20 0.59
PPARG P37231 7/20 0.59
PPARD Q03181 7/20 0.59
PPARA Q07869 7/20 0.59
HDAC11 Q96DB2 5/20 0.59
TSHR P16473 4/20 0.59
PTPN1 P18031 3/20 0.59
ALDH1A1 P00352 2/20 0.59
TLR2 O60603 2/20 0.59
TDP1 Q9NUW8 2/20 0.59
FABP4 P15090 2/20 0.59
KMT2A Q03164 2/20 0.59
SLC22A6 Q4U2R8 1/20 0.59
SLC22A8 Q8TCC7 1/20 0.59
MEN1 O00255 1/20 0.59
ESR1 P03372 1/20 0.59
ALOX15 P16050 1/20 0.59
PDE4A P27815 1/20 0.59
PDE3A Q14432 1/20 0.59

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13720120 1.00 SCD (0.59) SCDGPR84PPARGPPARDPPARA
SCHEMBL13062954 1.00 SCD (0.59) SCDGPR84PPARGPPARDPPARA
SCHEMBL21451806 0.92 SCD (0.54) SCDGPR84PPARGPPARDPPARA
SCHEMBL17946537 0.86 LTB4R (0.50) SCDGPR84PPARGPPARDPPARA
SCHEMBL14155956 0.86 EPHX2 (0.61) PPARGPPARDPPARATSHRPTPN1
SCHEMBL16356243 0.86 EPHX2 (0.61) PPARGPPARDPPARATSHRPTPN1
SCHEMBL10403682 0.85 GPR84 (0.74) SCDGPR84PPARGPPARDPPARA
SCHEMBL10404966 0.85 GPR84 (0.74) SCDGPR84PPARGPPARDPPARA
SCHEMBL25170031 0.84 CYSLTR2 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL27262058 0.84 CYSLTR2 (0.68) GPR84PPARGPPARDPPARAHDAC11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240239988-A1 SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-18 US disclosed
US-20240239988-A1 SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-18 US disclosed
US-20230399548-A1 BONDING FILM FOR HIGH-SPEED COMMUNICATION BOARD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230399467-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED SURFACE OF SUBSTRATE WITH SEMICONDUCTOR ELEMENT MOUNTED THEREON OR SEMICONDUCTOR ELEMENT-FORMING SURFACE OF WAFER WITH SEMICONDUCTOR ELEMENT FORMED THEREON, AND USE THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230399467-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED SURFACE OF SUBSTRATE WITH SEMICONDUCTOR ELEMENT MOUNTED THEREON OR SEMICONDUCTOR ELEMENT-FORMING SURFACE OF WAFER WITH SEMICONDUCTOR ELEMENT FORMED THEREON, AND USE THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230399548-A1 BONDING FILM FOR HIGH-SPEED COMMUNICATION BOARD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-14 US disclosed
US-20230340299-A1 METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-26 US disclosed
US-20230340299-A1 METHOD FOR PRODUCING CURED PRODUCT OF HEAT-CURABLE MALEIMIDE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-26 US disclosed
US-20230276606-A1 ELECTROMAGNETIC WAVE SHIELDING SHEET SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-31 US disclosed
US-20230276606-A1 ELECTROMAGNETIC WAVE SHIELDING SHEET SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-08-31 US disclosed
US-10550282-B2 Cationic electrodeposition coating composition TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2020-02-04 US disclosed
US-20190309116-A1 Method For Preparing Nitrile-Based Rubber LG CHEM, LTD. (KR) 2019-10-10 US disclosed
US-20160208133-A1 CATIONIC ELECTRODEPOSITION COATING COMPOSITION TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2016-07-21 US disclosed
US-20160208133-A1 CATIONIC ELECTRODEPOSITION COATING COMPOSITION TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2016-07-21 US disclosed
US-9360783-B2 Toner for electrostatic image development Konica Minolta, Inc. (JP) 2016-06-07 US disclosed
US-9360783-B2 Toner for electrostatic image development Konica Minolta, Inc. (JP) 2016-06-07 US disclosed
US-20140377700-A1 TONER FOR ELECTROSTATIC IMAGE DEVELOPMENT Konica Minolta, Inc. (JP) 2014-12-25 US disclosed
US-20140377700-A1 TONER FOR ELECTROSTATIC IMAGE DEVELOPMENT Konica Minolta, Inc. (JP) 2014-12-25 US disclosed
US-20130123390-A1 CURING AGENT COMPOSITION FOR EPOXY RESIN ADHESIVE FOR POROUS MATERIAL YAMAHA CORPORATION (JP) 2013-05-16 US disclosed
US-20130123390-A1 CURING AGENT COMPOSITION FOR EPOXY RESIN ADHESIVE FOR POROUS MATERIAL YAMAHA CORPORATION (JP) 2013-05-16 US disclosed