SCHEMBL14972607

SCHEMBL14972607

CC(C)(C)C1CC(N)CCC1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21950148 0.78
SCHEMBL8187101 0.78
SCHEMBL25069525 0.78
SCHEMBL13396214 0.78
SCHEMBL28772059 0.75
SCHEMBL9692865 0.75
SCHEMBL14093065 0.69 THRB (0.47)
SCHEMBL13770018 0.69
SCHEMBL14806568 0.69
SCHEMBL14667058 0.69 THRB (0.47)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 208 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111770949-B Polyimide, polyimide solution composition, polyimide film, and substrate UBE株式会社 2024-01-16 CN claimed
EP-3692091-A2 OPTICALLY TRANSPARENT POLYIMIDES Zymergen Inc. (US) 2020-08-12 EP claimed
CN-111479853-A Optically transparent polyimide 齐默尔根公司 2020-07-31 CN claimed
US-20200239635-A1 OPTICALLY TRANSPARENT POLYIMIDES AKRON POLYMER SYSTEMS, INC. 2020-07-30 US claimed
CN-117241942-B Laminate body 东洋纺株式会社 2026-05-19 CN disclosed
US-20260071029-A1 POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM AND POLYIMIDE/SUBSTRATE LAMINATE UBE CORP (JP) 2026-03-12 US disclosed
US-20260071028-A1 BINDER FOR ENERGY STORAGE DEVICE, ELECTRODE FOR ENERGY STORAGE DEVICE, ENERGY STORAGE DEVICE, POLYMER COMPOSITE, AND PRODUCTION METHOD OF BINDER FOR ENERGY STORAGE DEVICE UBE CORP (JP) 2026-03-12 US disclosed
EP-4674891-A1 POLYIMIDE POWDER FOR MOLDED BODY, AND POLYIMIDE MOLDED BODY UBE Corporation (JP) 2026-01-07 EP disclosed
US-12479194-B2 Laminate TOYOBO CO., LTD. (JP) 2025-11-25 US disclosed
US-12472732-B2 Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device TOYOBO CO., LTD. (JP) 2025-11-18 US disclosed
US-12441841-B2 Optically transparent polyimides AKRON POLYMER SYSTEMS, INC. (US) 2025-10-14 US disclosed
US-12391813-B2 Layered body including inorganic substrate and polyamic acid cured product TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
US-20160137787-A1 POLYMIDE PRECURSOR AND POLYMIDE UBE INDUSTRIES, LTD. (JP) 2016-05-19 US disclosed
US-20150361222-A1 POLYIMIDE PRECURSOR, POLYIMIDE, VARNISH, POLYIMIDE FILM, AND SUBSTRATE UBE CORPORATION (JP) 2015-12-17 US disclosed
US-20150307662-A1 POLYIMIDE PRECURSOR, POLYIMIDE, POLYIMIDE FILM, VARNISH, AND SUBSTRATE UBE CORPORATION (JP) 2015-10-29 US disclosed
US-20150284513-A1 POLYIMIDE PRECURSOR, POLYIMIDE, VARNISH, POLYIMIDE FILM, AND SUBSTRATE UBE INDUSTRIES, LTD. (JP) 2015-10-08 US disclosed
CN-104837894-A Polyimide precursor, polyimide film, varnish, and substrate UBE INDUSTRIES 2015-08-12 CN disclosed
US-20150158980-A1 POLYIMIDE PRECURSOR AND POLYIMIDE UBE CORPORATION (JP) 2015-06-11 US disclosed
US-20130178597-A1 POLYIMIDE PRECURSOR, POLYIMIDE, AND MATERIALS TO BE USED IN PRODUCING SAME UBE INDUSTRIES, LTD. (JP) 2013-07-11 US disclosed
EP-2597111-A1 POLYIMIDE PRECURSOR, POLYIMIDE, AND MATERIALS TO BE USED IN PRODUCING SAME Ube Industries, Ltd. (JP) 2013-05-29 EP disclosed