SCHEMBL1498049

SCHEMBL1498049

C[Si]([O])(Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1498110 0.88
SCHEMBL15341 0.72
SCHEMBL15658212 0.72 ALDH1A1 (1.00)
SCHEMBL28149045 0.72 ALDH1A1 (0.71)
SCHEMBL1319 0.72
SCHEMBL17738 0.72
SCHEMBL4389530 0.72
SCHEMBL10404218 0.72 ALDH1A1 (0.71)
SCHEMBL2684602 0.72
SCHEMBL17331 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 102 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8361622-B2 Highly disperse metal oxides having a high positive surface charge WACKER CHEMIE AG (DE) 2013-01-29 US claimed
EP-3774300-B1 GENERATIVE METHOD FOR PRODUCING MOLDED BODIES WACKER CHEMIE AG (DE) 2021-10-06 EP disclosed
US-20210107210-A1 ADDITIVE METHOD OF PRODUCING MOLDED BODIES WACKER CHEMIE AG (DE) 2021-04-15 US disclosed
EP-3774300-A1 GENERATIVE METHOD FOR PRODUCING MOLDED BODIES Wacker Chemie AG (DE) 2021-02-17 EP disclosed
US-10899080-B2 Method for producing shaped bodies WACKER CHEMIE AG (DE) 2021-01-26 US disclosed
CN-107922268-B Silicon dioxide moulded body with low thermal conductivity 瓦克化学股份公司 2021-01-05 CN disclosed
US-10843965-B2 Silica molded bodies having low thermal conductivity WACKER CHEMIE AG (DE) 2020-11-24 US disclosed
CN-111886124-A Generative method for producing molded bodies 瓦克化学股份公司 2020-11-03 CN disclosed
US-20200317923-A1 GENERATIVE METHOD FOR PRODUCING MOLDED BODIES USING A SUPPORT MATERIAL MADE OF WAX WACKER CHEMIE AG (DE) 2020-10-08 US disclosed
US-20200308051-A2 SILICA MOLDED BODIES HAVING LOW THERMAL CONDUCTIVITY WACKER CHEMIE AG (DE) 2020-10-01 US disclosed
US-20030211933-A1 Aluminum compound, method for producing the same, catalyst for producing olefinic polymers and method for producing olefinic polymers IDEMITSU KOSAN CO., LTD. (JP) 2003-11-13 US disclosed
US-20030138715-A1 Low-silanol silica WACKER-CHEMIE GMBH (DE) 2003-07-24 US disclosed
US-20030100631-A1 Silylation by using a pure organosiloxane obtained without emission of toxic elimination products and without having unwanted side reactions; pollution control; flow control agents; thickeners; anticaking agents antiagglomerants WACKER-CHEMIE GMBH (DE) 2003-05-29 US disclosed
EP-1304361-A1 Silica with homogenous silylating agent coating Wacker-Chemie GmbH (DE) 2003-04-23 EP disclosed
EP-1302444-A1 Silica with low content of silanol groups Wacker-Chemie GmbH (DE) 2003-04-16 EP disclosed
EP-0984016-A1 ALUMINUM COMPOUND AND PROCESS FOR PRODUCING THE SAME, CATALYST FOR OLEFIN POLYMER PRODUCTION, AND PROCESS FOR PRODUCING OLEFIN POLYMER IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2000-03-08 EP disclosed
US-5851715-A Process for the silylation of inorganic oxides WACKER-CHEMIE GMBH (DE) 1998-12-22 US disclosed
EP-0686676-B1 Process for silylating inorganic oxides and silylated silica WACKER CHEMIE GMBH (DE) 1998-08-19 EP disclosed
US-5686054-A Process for the silylation of inorganic oxides WACKER-CHEMIE GMBH (DE) 1997-11-11 US disclosed
EP-0686676-A1 Process for silylating inorganic oxides Wacker-Chemie GmbH (DE) 1995-12-13 EP disclosed