SCHEMBL4389530

SCHEMBL4389530

C[Si](C)([O])[O]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15341 0.83
SCHEMBL28222281 0.77
SCHEMBL28152283 0.77
SCHEMBL59794 0.72
SCHEMBL679256 0.72
SCHEMBL23829797 0.72
SCHEMBL9705843 0.72
SCHEMBL403290 0.72
SCHEMBL1498110 0.72
SCHEMBL1498049 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0903385-B1 Low coefficient of friction silicone release formulations GEN ELECTRIC (US) 2001-12-05 EP claimed
US-5942557-A Low coefficient of friction silicone release formulations GENERAL ELECTRIC COMPANY (US) 1999-08-24 US claimed
EP-0903385-A1 Low coefficient of friction silicone release formulations GENERAL ELECTRIC COMPANY (US) 1999-03-24 EP claimed
WO-2024106077-A1 DISASSEMBLY METHOD FOR BONDED MEMBER AND EASILY-DISASSEMBLED SILICONE-BASED LIQUID ADHESIVE AGENT 信越化学工業株式会社 2024-05-23 WO disclosed
US-7632425-B1 Composition and associated method GENERAL ELECTRIC COMPANY (US) 2009-12-15 US disclosed
US-20090302280-A1 COMPOSITION AND ASSOCIATED METHOD GENERAL ELECTRIC COMPANY (US) 2009-12-10 US disclosed
WO-2008127282-A2 COMPOSITION AND ASSOCIATED METHOD MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-10-23 WO disclosed
WO-2008045351-A2 COMPOSITION AND ASSOCIATED METHOD MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-04-17 WO disclosed
US-20080085962-A1 Silver nanoparticles; produced by reduction of carbamate salt; electrical and thermal conductive adhesives GENERAL ELECTRIC COMPANY (US) 2008-04-10 US disclosed
US-20080083299-A1 COMPOSITION AND ASSOCIATED METHOD GENERAL ELECTRIC COMPANY (US) 2008-04-10 US disclosed
US-20080085410-A1 COMPOSITION AND ASSOCIATED METHOD GENERAL ELECTRIC COMPANY (US) 2008-04-10 US disclosed
WO-2001098420-A2 SILICONE COATINGS CONTAINING SILICONE MIST SUPPRESSANT COMPOSITIONS DOW CORNING CORPORATION (US) 2001-12-27 WO disclosed
WO-2001098418-A2 SILICONE COATINGS CONTAINING SILICONE MIST SUPPRESSANT COMPOSITIONS DOW CORNING CORPORATION (US) 2001-12-27 WO disclosed
EP-0903385-B1 Low coefficient of friction silicone release formulations GEN ELECTRIC (US) 2001-12-05 EP disclosed
EP-0791607-B1 Substituted metallocene catalyst for the (co)polymerization of olefins ENICHEM SPA (IT) 2001-05-02 EP disclosed
US-5942557-A Low coefficient of friction silicone release formulations GENERAL ELECTRIC COMPANY (US) 1999-08-24 US disclosed
US-5936051-A FORMING POLYMERS OF HIGH MOLECULAR WEIGHT; CHEMICAL AND HEAT RESISTANCE; ALUMOXANE COCATALYSTS ENICHEM S.P.A. (IT) 1999-08-10 US disclosed
EP-0903385-A1 Low coefficient of friction silicone release formulations GENERAL ELECTRIC COMPANY (US) 1999-03-24 EP disclosed
EP-0791607-A2 Substituted metallocene catalyst for the (co)polymerization of olefins ENICHEM S.p.A. (IT) 1997-08-27 EP disclosed
US-5650453-A EPOXYSILICONE POLYMERS AND VINYL ETHER MONOMERS WITH IODONIUM PHOTOCATALYST TO PROVIDE SILICONE COATING GENERAL ELECTRIC COMPANY (US) 1997-07-22 US disclosed