SCHEMBL1498073

SCHEMBL1498073

CCO[Si](C)([O])OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1428877 0.79
SCHEMBL57765 0.74 KMT2A (0.30)
SCHEMBL3424226 0.73
SCHEMBL3424096 0.73
SCHEMBL15402246 0.71
SCHEMBL648046 0.69
SCHEMBL9123116 0.69
SCHEMBL34977 0.69
SCHEMBL27813 0.69
SCHEMBL647513 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 163 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8361622-B2 Highly disperse metal oxides having a high positive surface charge WACKER CHEMIE AG (DE) 2013-01-29 US claimed
EP-1388572-B1 Addition reaction curable organopolysiloxane composition SHINETSU CHEMICAL CO (JP) 2007-10-03 EP claimed
US-6913833-B2 Addition reaction curable organopolysiloxane composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-07-05 US claimed
US-20040028917-A1 Addition reaction curable organopolysiloxane composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-02-12 US claimed
EP-1388572-A1 Addition reaction curable organopolysiloxane composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-02-11 EP claimed
EP-4386053-A2 SILOXANE POLYMER COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, OPTICAL COMPONENT, AND COMPOSITE MEMBER JNC Corporation (JP) 2024-06-19 EP disclosed
WO-2023080221-A1 COMPOUND, POLYMER, PHOTOSTABILIZER COMPOSITION, RESIN COMPOSITION, COATING MATERIAL COMPOSITION, ARTICLE, SEALING MATERIAL, MOLDED ARTICLE, METHOD FOR PRODUCING WEATHER-RESISTANT RESIN COMPOSITION, AND METHOD FOR IMPROVING WEATHER RESISTANCE OF SYNTHETIC RESIN 株式会社ADEKA 2023-05-11 WO disclosed
WO-2022202173-A1 CURABLE RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2022-09-29 WO disclosed
CN-115003759-A Resin composition, method for producing same, and multi-component curable resin composition 株式会社钟化 2022-09-02 CN disclosed
EP-3719075-B1 CURABLE SILICONE RUBBER COMPOSITION DOW TORAY CO LTD (JP) 2022-06-15 EP disclosed
CN-110651336-B Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition 株式会社钟化 2022-05-17 CN disclosed
CN-114008113-A Resin composition, method for producing same, and multi-component curable resin composition 株式会社钟化 2022-02-01 CN disclosed
US-5504174-A ADHESIVE COMPRISING ALKOXY-CONTAINING POLYSILOXANE, ALKENYL-CONTAINING POLYSILOXANE, AN ORGANOHYDROGENSILOXANE, AN ALKOXYSILANE, A TITANIUM CATALYST AND A HYDROSILATION CATALYST; BONDING STRENGTH DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-04-02 US disclosed
EP-0540040-B1 Room-temperature-curable organopolysiloxane composition DOW CORNING TORAY SILICONE (JP) 1996-01-24 EP disclosed
EP-0686676-A1 Process for silylating inorganic oxides Wacker-Chemie GmbH (DE) 1995-12-13 EP disclosed
EP-0664322-A1 Curable organopolysiloxane composition with condensation reaction curing and addition reaction curing Dow Corning Toray Silicone Company, Limited (JP) 1995-07-26 EP disclosed
US-5405889-A Including a rosin ester which is an esterification product of rosin and a polyol DOW CORNING TORAY SILICONE CO., LTD. (JP) 1995-04-11 US disclosed
EP-0640657-A2 One-component polysiloxane compositions BAYER AG (DE) 1995-03-01 EP disclosed
EP-0640659-A2 One-component polysiloxane compositions BAYER AG (DE) 1995-03-01 EP disclosed
EP-0540040-A1 Room-temperature-curable organopolysiloxane composition Dow Corning Toray Silicone Company, Limited (JP) 1993-05-05 EP disclosed