SCHEMBL648046

SCHEMBL648046

CCO[Si](C)(OCC)[Si](C)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL249241 0.88
SCHEMBL648680 0.82
SCHEMBL647684 0.82
SCHEMBL26667621 0.79
SCHEMBL1025141 0.77
SCHEMBL9238426 0.77
SCHEMBL9123116 0.75
SCHEMBL27813 0.75
SCHEMBL34977 0.75
SCHEMBL647513 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 368 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3663301-B1 BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF BORON CONTAINING FILMS VERSUM MAT US LLC (US) 2023-08-30 EP claimed
US-10985013-B2 Method and precursors for manufacturing 3D devices VERSUM MATERIALS US, LLC (US) 2021-04-20 US claimed
CN-105845549-B Method and precursor for manufacturing 3D devices 弗萨姆材料美国有限责任公司 2020-03-03 CN claimed
US-20190304775-A1 Method and Precursors for Manufacturing 3D Devices VERSUM MATERIALS US, LLC (US) 2019-10-03 US claimed
US-10354860-B2 Method and precursors for manufacturing 3D devices VERSUM MATERIALS US, LLC (US) 2019-07-16 US claimed
US-20180047898-A1 PROCESS FOR DEPOSITING POROUS ORGANOSILICATE GLASS FILMS FOR USE AS RESISTIVE RANDOM ACCESS MEMORY AIR PRODUCTS AND CHEMICALS, INC. 2018-02-15 US claimed
US-20160225616-A1 METHOD AND PRECURSORS FOR MANUFACTURING 3D DEVICES AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-08-04 US claimed
EP-3051001-A2 METHOD AND PRECURSORS FOR MANUFACTURING 3D DEVICES AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-08-03 EP claimed
EP-1482070-B1 MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS AIR PROD & CHEM (US) 2015-11-11 EP claimed
US-8137764-B2 organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-03-20 US claimed
US-7875317-B2 formed by hydrolyzing and condensing a siloxy compound in the presence of a polycarbosilane; low relative dielectric constant and excellent mechanical strength, storage stability, and chemical resistance; semiconductors JSR CORPORATION (JP) 2011-01-25 US claimed
CN-101441415-A Antireflective coatings AIR PROD & CHEM (US) 2009-05-27 CN claimed
US-20090096106-A1 ANTIREFLECTIVE COATINGS AIR PRODUCTS AND CHEMICALS, INC. (US) 2009-04-16 US claimed
EP-2048700-A2 Antireflective coatings Air Products and Chemicals, Inc. (US) 2009-04-15 EP claimed
US-20080246153-A1 ORGANIC SILICA-BASED FILM, METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING INSULATING FILM FOR SEMICONDUCTOR DEVICE, INTERCONNECT STRUCTURE, AND SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2008-10-09 US claimed
US-7399715-B2 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2008-07-15 US claimed
CN-1311097-C Mechanical enhancer additives for low dielectric films AIR PROD & CHEM (US) 2007-04-18 CN claimed
CN-1576390-A Mechanical enhancer additives for low dielectric films AIR PROD & CHEM (US) 2005-02-09 CN claimed
US-20040241463-A1 Mechanical enhancer additives for low dielectric films VERSUM MATERIALS US, LLC 2004-12-02 US claimed
EP-1482070-A1 Mechanical enhancer additives for low dielectric films AIR PRODUCTS AND CHEMICALS, INC. (US) 2004-12-01 EP claimed