SCHEMBL1498074

SCHEMBL1498074

CC(=O)O[Si](C)(O)OC(C)=O

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
TSHR P16473 2/20 0.39
LMNA P02545 3/20 0.32
HSD17B10 Q99714 2/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9704519 0.80
SCHEMBL8760645 0.76 ALDH1A1 (0.41) ALDH1A1TSHRLMNAHSD17B10TDP1
SCHEMBL5361795 0.76 ALDH1A1 (0.41) ALDH1A1TSHRLMNAHSD17B10TDP1
SCHEMBL2710137 0.76
SCHEMBL63651 0.76 ALDH1A1 (0.41) ALDH1A1TSHRLMNAHSD17B10TDP1
SCHEMBL74717 0.76 ALDH1A1 (0.41) ALDH1A1TSHRLMNAHSD17B10TDP1
SCHEMBL728853 0.76 ALDH1A1 (0.41) ALDH1A1TSHRLMNAHSD17B10TDP1
SCHEMBL338658 0.76
SCHEMBL23781789 0.73 ALDH1A1 (0.39) ALDH1A1TSHRLMNAHSD17B10TDP1
SCHEMBL1498070 0.73 ALDH1A1 (0.39) ALDH1A1TSHRLMNAHSD17B10TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8361622-B2 Highly disperse metal oxides having a high positive surface charge WACKER CHEMIE AG (DE) 2013-01-29 US claimed
EP-4386053-A2 SILOXANE POLYMER COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, OPTICAL COMPONENT, AND COMPOSITE MEMBER JNC Corporation (JP) 2024-06-19 EP disclosed
US-10843965-B2 Silica molded bodies having low thermal conductivity WACKER CHEMIE AG (DE) 2020-11-24 US disclosed
US-20200317923-A1 GENERATIVE METHOD FOR PRODUCING MOLDED BODIES USING A SUPPORT MATERIAL MADE OF WAX WACKER CHEMIE AG (DE) 2020-10-08 US disclosed
US-20200308051-A2 SILICA MOLDED BODIES HAVING LOW THERMAL CONDUCTIVITY WACKER CHEMIE AG (DE) 2020-10-01 US disclosed
EP-3341338-B1 SILICA MOLDED BODIES HAVING LOW THERMAL CONDUCTIVITY WACKER CHEMIE AG (DE) 2018-12-12 EP disclosed
EP-3341338-A1 SILICA MOLDED BODIES HAVING LOW THERMAL CONDUCTIVITY Wacker Chemie AG (DE) 2018-07-04 EP disclosed
US-9527874-B2 Process for surface modification of particulate solids WACKER CHEMIE AG (DE) 2016-12-27 US disclosed
EP-2825600-B1 PROCESS FOR SURFACE MODIFICATION OF PARTICULATE SOLIDS WACKER CHEMIE AG (DE) 2016-03-02 EP disclosed
US-20150025261-A1 PROCESS FOR SURFACE MODIFICATION OF PARTICULATE SOLIDS WACKER CHEMIE AG (DE) 2015-01-22 US disclosed
US-20030100631-A1 Silylation by using a pure organosiloxane obtained without emission of toxic elimination products and without having unwanted side reactions; pollution control; flow control agents; thickeners; anticaking agents antiagglomerants WACKER-CHEMIE GMBH (DE) 2003-05-29 US disclosed
EP-1304361-A1 Silica with homogenous silylating agent coating Wacker-Chemie GmbH (DE) 2003-04-23 EP disclosed
EP-1302444-A1 Silica with low content of silanol groups Wacker-Chemie GmbH (DE) 2003-04-16 EP disclosed
US-5851715-A Process for the silylation of inorganic oxides WACKER-CHEMIE GMBH (DE) 1998-12-22 US disclosed
EP-0686676-B1 Process for silylating inorganic oxides and silylated silica WACKER CHEMIE GMBH (DE) 1998-08-19 EP disclosed
US-5686054-A Process for the silylation of inorganic oxides WACKER-CHEMIE GMBH (DE) 1997-11-11 US disclosed
US-5670560-A MIXING, HEATING POLYSILOXANE, REINFORCING SILICA AND DIOL DOW CORNING CORPORATION (US) 1997-09-23 US disclosed
EP-0776942-A2 Method of making a pumpable, stable polydiorganosiloxane-silica mixture and room temperature curing sealant DOW CORNING CORPORATION (US) 1997-06-04 EP disclosed
EP-0686676-A1 Process for silylating inorganic oxides Wacker-Chemie GmbH (DE) 1995-12-13 EP disclosed
WO-1992008758-A1 SILICONE SURFACE-MODIFIED AMMONIUM POLYPHOSPHATE PPG INDUSTRIES, INC. (US) 1992-05-29 WO disclosed