SCHEMBL15024124

SCHEMBL15024124

CCCCCC(C)OC(=O)CCCN1C(=O)C=CC1=O

nearest known ligand 0.51

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 7/20 0.51
PTGS2 P35354 7/20 0.51
FAAH O00519 7/20 0.51
MGLL Q99685 4/20 0.51
CNR1 P21554 1/20 0.45
CNR2 P34972 1/20 0.45
LMNA P02545 2/20 0.43
ALDH1A1 P00352 1/20 0.41
MAPT P10636 2/20 0.41
ALOX15 P16050 1/20 0.40
CASP1 P29466 1/20 0.40
CASP7 P55210 1/20 0.40
HSD17B10 Q99714 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15023985 0.92 PTGS1 (0.51) PTGS1PTGS2FAAHMGLLCNR1
SCHEMBL14015891 0.84 PTGS1 (0.59) PTGS1PTGS2FAAHMGLLLMNA
SCHEMBL12993987 0.84 PTGS1 (0.59) PTGS1PTGS2FAAHMGLLLMNA
SCHEMBL15024046 0.83 MAPT (0.46) PTGS1PTGS2FAAHMGLLLMNA
SCHEMBL15024059 0.82 PTGS1 (0.47) PTGS1PTGS2FAAHMGLLCNR1
SCHEMBL15394083 0.81 LMNA (0.53) PTGS1PTGS2FAAHMGLLLMNA
SCHEMBL14868156 0.80 LMNA (0.44) PTGS1PTGS2FAAHMGLLCNR1
SCHEMBL9958885 0.79 LMNA (0.66) FAAHCNR1CNR2LMNAALDH1A1
SCHEMBL27879559 0.79 LMNA (0.66) FAAHCNR1CNR2LMNAALDH1A1
SCHEMBL22534407 0.79 FAAH (0.60) FAAHCNR1CNR2LMNAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8754178-B2 Resin composition and semiconductor device produced using resin composition SUMITOMO BAKELITE CO., LTD. (JP) 2014-06-17 US disclosed
EP-2615122-A1 RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE PRODUCED USING RESIN COMPOSITION Sumitomo Bakelite Co., Ltd. (JP) 2013-07-17 EP disclosed
US-20130158188-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED USING RESIN COMPOSITION SUMITOMO BAKELITE CO., LTD. (JP) 2013-06-20 US disclosed