SCHEMBL15045355

SCHEMBL15045355

OCc1cccc(C(c2cccc(CO)c2)C(c2cc(CO)cc(CO)c2)c2cc(CO)cc(CO)c2)c1

nearest known ligand 0.48

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ENPP2 Q13822 1/20 0.48
PRSS1 P07477 1/20 0.41
PRSS2 P07478 1/20 0.41
PRSS3 P35030 1/20 0.41
TSHR P16473 1/20 0.41
PRKCI P41743 1/20 0.40
CYP11B1 P15538 1/20 0.39
CYP11B2 P19099 1/20 0.39
ACMSD Q8TDX5 1/20 0.38
PGK1 P00558 3/20 0.37
PGK2 P07205 3/20 0.37
DAO P14920 1/20 0.37
MRGPRX4 Q96LA9 1/20 0.37
NOS3 P29474 2/20 0.36
NOS1 P29475 2/20 0.36
NOS2 P35228 2/20 0.36
CFTR P13569 1/20 0.36
S1PR1 P21453 3/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL123838 0.79 TSHR (0.61) ENPP2PRSS1PRSS2PRSS3TSHR
SCHEMBL10606510 0.78 ENPP2 (0.47) ENPP2PRSS1PRSS2PRSS3TSHR
SCHEMBL6252441 0.78 TSHR (0.50) ENPP2PRSS1PRSS2PRSS3TSHR
SCHEMBL25470940 0.77 TSHR (0.45) ENPP2PRSS1PRSS2PRSS3TSHR
SCHEMBL3279344 0.77 HDAC4 (0.47) ENPP2PRSS1PRSS2PRSS3TSHR
SCHEMBL9216952 0.77 ENPP2 (0.45) ENPP2PRSS1PRSS2PRSS3TSHR
SCHEMBL11888529 0.77 ENPP2 (0.45) ENPP2PRSS1PRSS2PRSS3TSHR
SCHEMBL15045358 0.77 TDP1 (0.50) ENPP2ACMSDPGK1PGK2
SCHEMBL31568542 0.77 ENPP2 (0.45) ENPP2PRSS1PRSS2PRSS3TSHR
Hydrochloric Acid SCHEMBL14334287 0.77 ENPP2 (0.58) ENPP2PRSS1PRSS2PRSS3TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8815988-B2 Resin compound, resin composition, and resin-molded product FUJI XEROX CO., LTD. (JP) 2014-08-26 US disclosed
US-20130158173-A1 RESIN COMPOUND, RESIN COMPOSITION, AND RESIN-MOLDED PRODUCT FUJI XEROX CO., LTD. (JP) 2013-06-20 US disclosed