SCHEMBL15064776

SCHEMBL15064776

C=CCC(C[Si](OCC)(OCC)OCC)OCC1CO1

nearest known ligand 0.37

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15064672 0.85 ALDH1A1 (0.39) ALDH1A1
SCHEMBL231866 0.83 ALDH1A1 (0.34) ALDH1A1
SCHEMBL15065289 0.79 ALDH1A1 (0.35) ALDH1A1
SCHEMBL27682788 0.79 ALDH1A1 (0.44) ALDH1A1
SCHEMBL15065261 0.77 ALDH1A1 (0.39) ALDH1A1
SCHEMBL188407 0.75 SMN1; SMN2 (0.34) ALDH1A1
SCHEMBL28063191 0.75 SMN1; SMN2 (0.34) ALDH1A1
SCHEMBL27170277 0.75 ALDH1A1 (0.46) ALDH1A1
SCHEMBL5370788 0.74 SMN1; SMN2 (0.33) ALDH1A1
SCHEMBL15065575 0.72 SMN1; SMN2 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2618216-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEMICAL CO LTD (JP) 2019-05-29 EP disclosed
US-8836089-B2 Positive photosensitive resin composition, method of creating resist pattern, and electronic component HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-09-16 US disclosed
EP-2618216-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical Co., Ltd. (JP) 2013-07-24 EP disclosed
US-20130168859-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT RESONAC CORPORATION (JP) 2013-07-04 US disclosed