SCHEMBL15065463

SCHEMBL15065463

CC/C=C(\OCC1CO1)[Si](OCC)(OCC)OCC

nearest known ligand 0.37

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.37
TP53 P04637 1/20 0.33
CYP3A4 P08684 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
TDP1 Q9NUW8 1/20 0.31
TSHR P16473 1/20 0.30
MAPK1 P28482 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15065464 1.00 ALDH1A1 (0.37) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15065142 0.88 ALDH1A1 (0.35) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15065143 0.88 ALDH1A1 (0.35) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15064634 0.87 ALDH1A1 (0.39) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15064635 0.87 ALDH1A1 (0.39) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15064602 0.85 ALDH1A1 (0.38) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15064601 0.85 ALDH1A1 (0.38) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15064568 0.75 ALDH1A1 (0.35) ALDH1A1TP53CYP3A4SMN1; SMN2
SCHEMBL15064567 0.75 ALDH1A1 (0.35) ALDH1A1TP53CYP3A4SMN1; SMN2
SCHEMBL27916735 0.74 ALDH1A1 (0.42) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2618216-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEMICAL CO LTD (JP) 2019-05-29 EP disclosed
US-8836089-B2 Positive photosensitive resin composition, method of creating resist pattern, and electronic component HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-09-16 US disclosed
EP-2618216-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical Co., Ltd. (JP) 2013-07-24 EP disclosed
US-20130168859-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT RESONAC CORPORATION (JP) 2013-07-04 US disclosed