SCHEMBL15329318

SCHEMBL15329318

CCC(C)N(CCCN)C(C)CC

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CHRM2 P08172 1/20 0.33
DNM1 Q05193 8/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
ALDH1A1 P00352 1/20 0.32
TSHR P16473 1/20 0.32
EPHX1 P07099 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15330048 0.93 CHRM2 (0.42) CHRM2DNM1MEN1KMT2AALDH1A1
SCHEMBL3684348 0.91 CHRM2 (0.46) CHRM2DNM1MEN1KMT2AALDH1A1
SCHEMBL6651787 0.84
SCHEMBL9640863 0.80 CHRM2 (0.33) CHRM2DNM1MEN1KMT2AALDH1A1
SCHEMBL7770556 0.79 DNM1 (0.32) DNM1ALDH1A1TSHR
SCHEMBL5090997 0.78 CHRM2 (0.32) CHRM2TSHR
SCHEMBL20197088 0.76 CHRM2 (0.31) CHRM2
SCHEMBL18797279 0.76 CYP2C19 (0.48) MEN1KMT2AALDH1A1TSHR
SCHEMBL825691 0.76 MEN1 (0.46) CHRM2DNM1MEN1KMT2AALDH1A1
SCHEMBL7208214 0.75 CHRM2 (0.33) CHRM2DNM1MEN1KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250343042-A1 DIFFUSING AGENT COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2025-11-06 US disclosed
WO-2023238799-A1 DIFFUSING AGENT COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE 東京応化工業株式会社 2023-12-14 WO disclosed
US-11773287-B2 Method for forming coating TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-03 US disclosed
US-20230011185-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-12 US disclosed
CN-115315783-A Laminate, method for producing laminate, and method for producing semiconductor substrate 东京应化工业株式会社 2022-11-08 CN disclosed
US-11120993-B2 Diffusing agent composition and method of manufacturing semiconductor substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2021-09-14 US disclosed
US-20200373162-A1 DIFFUSING AGENT COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-26 US disclosed
US-20200369914-A1 METHOD FOR FORMING COATING TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-26 US disclosed
EP-2841537-A1 USE OF ADDITIVES WITH DETERGENT ACTION FOR FURTHER INCREASING THE CETANE NUMBER OF FUEL OILS BASF SE (DE) 2015-03-04 EP disclosed
WO-2013160294-A1 USE OF ADDITIVES WITH DETERGENT ACTION FOR FURTHER INCREASING THE CETANE NUMBER OF FUEL OILS BASF SE (DE) 2013-10-31 WO disclosed
US-20130276362-A1 USE OF ADDITIVES WITH DETERGENT ACTION FOR FURTHER INCREASING THE CETANE NUMBER OF FUEL OILS BASF SE (DE) 2013-10-24 US disclosed