⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19058307 | 0.90 | MEN1 (0.35) | — | |
| SCHEMBL15329318 | 0.84 | CHRM2 (0.33) | — | |
| SCHEMBL15330048 | 0.82 | CHRM2 (0.42) | — | |
| SCHEMBL3684348 | 0.80 | CHRM2 (0.46) | — | |
| SCHEMBL2479168 | 0.77 | TSHR (0.30) | — | |
| SCHEMBL27432896 | 0.76 | — | — | |
| SCHEMBL2277956 | 0.76 | ALDH1A1 (0.35) | — | |
| SCHEMBL18797279 | 0.75 | CYP2C19 (0.48) | — | |
| SCHEMBL29055681 | 0.75 | ALDH1A1 (0.38) | — | |
| SCHEMBL29055676 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250343042-A1 | DIFFUSING AGENT COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2025-11-06 | — | — | US | disclosed |
| WO-2023238799-A1 | DIFFUSING AGENT COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | 東京応化工業株式会社 | 2023-12-14 | — | — | WO | disclosed |
| US-11773287-B2 | Method for forming coating | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-03 | — | — | US | disclosed |
| US-20230011185-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-12 | — | — | US | disclosed |
| CN-115315783-A | Laminate, method for producing laminate, and method for producing semiconductor substrate | 东京应化工业株式会社 | 2022-11-08 | — | — | CN | disclosed |
| US-11120993-B2 | Diffusing agent composition and method of manufacturing semiconductor substrate | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-09-14 | — | — | US | disclosed |
| US-20200369914-A1 | METHOD FOR FORMING COATING | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-11-26 | — | — | US | disclosed |
| US-20200373162-A1 | DIFFUSING AGENT COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-11-26 | — | — | US | disclosed |
| EP-2841537-A1 | USE OF ADDITIVES WITH DETERGENT ACTION FOR FURTHER INCREASING THE CETANE NUMBER OF FUEL OILS | BASF SE (DE) | 2015-03-04 | — | — | EP | disclosed |
| WO-2013160294-A1 | USE OF ADDITIVES WITH DETERGENT ACTION FOR FURTHER INCREASING THE CETANE NUMBER OF FUEL OILS | BASF SE (DE) | 2013-10-31 | — | — | WO | disclosed |
| US-20130276362-A1 | USE OF ADDITIVES WITH DETERGENT ACTION FOR FURTHER INCREASING THE CETANE NUMBER OF FUEL OILS | BASF SE (DE) | 2013-10-24 | — | — | US | disclosed |
| EP-0875501-B1 | Alkylenediamine derivative, anti-ulcer drug, and antibacterial drug | SHISEIDO CO LTD (JP) | 2004-06-16 | — | — | EP | disclosed |
| EP-0875501-A2 | Alkylenediamine derivative, anti-ulcer drug, and antibacterial drug | SHISEIDO COMPANY LIMITED (JP) | 1998-11-04 | — | — | EP | disclosed |