SCHEMBL15345203

SCHEMBL15345203

OCCCOc1ccc(-c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ TDP1 Q9NUW8 1/20 0.54
▸ ALDH1A1 P00352 5/20 0.51
▸ TP53 P04637 3/20 0.51
▸ TSHR P16473 3/20 0.51
▸ MEN1 O00255 3/20 0.51
▸ KMT2A Q03164 3/20 0.51
▸ MAPT P10636 2/20 0.51
▸ HPGD P15428 2/20 0.51
▸ HIF1A Q16665 2/20 0.51
▸ PKM P14618 2/20 0.51
▸ CYP1A2 P05177 1/20 0.51
▸ PPARG P37231 1/20 0.51
▸ LMNA P02545 1/20 0.51
▸ GAA P10253 1/20 0.51
▸ CYP3A4 P08684 1/20 0.49
▸ SMN1; SMN2 Q16637 1/20 0.49
▸ GLA P06280 1/20 0.39
▸ RECQL P46063 1/20 0.39
▸ HRH3 Q9Y5N1 3/20 0.38
▸ MGLL Q99685 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14397616 0.95 TDP1 (0.59) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL13681406 0.92 TDP1 (0.46) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL12516201 0.90 TDP1 (0.54) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL10714083 0.90 TDP1 (0.61) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL12158385 0.88 TDP1 (0.51) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL13621716 0.86 TDP1 (0.50) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL13555513 0.86 TDP1 (0.50) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL15363128 0.86 TDP1 (0.50) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL12855111 0.86 TDP1 (0.50) TDP1ALDH1A1TP53TSHRMEN1
SCHEMBL18535692 0.86 TDP1 (0.70) TDP1ALDH1A1TP53TSHRMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170154801-A1 WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-06-01 — — US disclosed
US-20170053821-A1 WAFER PROCESSING BONDING ARRANGEMENT, WAFER LAMINATE, AND THIN WAFER MANUFACTURING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-02-23 — — US disclosed
US-9550931-B2 Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-24 — — US disclosed
US-20160093522-A1 WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-03-31 — — US disclosed
US-9096032-B2 Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-08-04 — — US disclosed
US-20140342530-A1 TEMPORARY ADHESIVE MATERIAL FOR WAFER, FILM FOR TEMPORARY ADHESION USING SAME, WAFER PROCESSING LAMINATE, AND METHOD FOR PRODUCING THIN WAFER USING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-11-20 — — US disclosed
US-20130280886-A1 WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-10-24 — — US disclosed
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