SCHEMBL15468481

SCHEMBL15468481

CC(OC(=O)n1ccnc1)c1ccc2c(c1)C(=O)c1ccccc1C2=O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP17A1 P05093 2/20 0.39
▸ CYP26A1 O43174 4/20 0.38
▸ MEN1 O00255 2/20 0.37
▸ NPC1 O15118 2/20 0.37
▸ ALDH1A1 P00352 2/20 0.37
▸ MAPT P10636 2/20 0.37
▸ RAB9A P51151 2/20 0.37
▸ KMT2A Q03164 2/20 0.37
▸ SMN1; SMN2 Q16637 2/20 0.37
▸ MAOA P21397 1/20 0.37
▸ CYP24A1 Q07973 1/20 0.37
▸ PTGS2 P35354 1/20 0.37
▸ FAAH O00519 1/20 0.36
▸ MGLL Q99685 1/20 0.36
▸ CYP19A1 P11511 1/20 0.36
▸ CYP1A2 P05177 1/20 0.35
▸ POLB P06746 1/20 0.35
▸ CYP3A4 P08684 1/20 0.35
▸ CYP2D6 P10635 1/20 0.35
▸ CYP2C9 P11712 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18633230 0.94 NR1H3 (0.37) CYP17A1CYP26A1MEN1NPC1ALDH1A1
SCHEMBL18633232 0.93 CYP24A1 (0.35) CYP17A1CYP26A1MEN1NPC1ALDH1A1
SCHEMBL19871338 0.85 TTR (0.40) MEN1NPC1ALDH1A1MAPTRAB9A
SCHEMBL23409278 0.82 FAAH (0.48) CYP17A1CYP26A1CYP24A1FAAHMGLL
SCHEMBL6565471 0.82 FAAH (0.48) CYP17A1CYP26A1CYP24A1FAAHMGLL
SCHEMBL16697922 0.82 FAAH (0.48) CYP17A1CYP26A1CYP24A1FAAHMGLL
SCHEMBL12269081 0.77 ALDH1A1 (0.53) MEN1NPC1ALDH1A1RAB9AKMT2A
SCHEMBL28857883 0.76 ALDH1A1 (0.49) MEN1NPC1ALDH1A1MAPTRAB9A
SCHEMBL18412608 0.75 ALDH1A1 (0.37) MEN1NPC1ALDH1A1MAPTRAB9A
SCHEMBL28857884 0.75 TTR (0.49) MEN1NPC1ALDH1A1MAPTRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 287 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115561966-B Chemical amplification type negative photosensitive polyimide coating adhesive and application thereof 明士(北京)新材料开发有限公司 2023-05-16 — — CN claimed
CN-115561966-A Chemical amplification type negative photosensitive polyimide coating adhesive and application 明士(北京)新材料开发有限公司 2023-01-03 — — CN claimed
CN-114874441-B Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-11-01 — — CN claimed
CN-114874441-A Chemical amplification type positive photosensitive polyimide coating adhesive and preparation method and application thereof 明士(北京)新材料开发有限公司 2022-08-09 — — CN claimed
CN-113372868-B Ultraviolet activated double-component super-hydrophobic polyurethane ring winding adhesive 武汉长盈鑫科技有限公司 2022-06-24 — — CN claimed
CN-114488690-A Chemical amplification type negative polyimide photoresist and preparation method and application thereof 中国科学院化学研究所 2022-05-13 — — CN claimed
CN-113372868-A Ultraviolet activated double-component super-hydrophobic polyurethane ring winding adhesive 武汉长盈鑫科技有限公司 2021-09-10 — — CN claimed
US-10429734-B2 Permanent dielectric compositions containing photoacid generator and base PROMERUS, LLC (US) 2019-10-01 — — US claimed
US-10409160-B2 Photoimageable polyolefin compositions containing photobase generators PROMERUS, LLC (US) 2019-09-10 — — US claimed
US-20180203349-A1 PHOTOIMAGEABLE POLYOLEFIN COMPOSITIONS CONTAINING PHOTOBASE GENERATORS PROMERUS, LLC (US) 2018-07-19 — — US claimed
US-9952507-B2 Photoimageable polyolefin compositions containing photobase generators PROMERUS, LLC (US) 2018-04-24 — — US claimed
US-20170153546-A1 PERMANENT DIELECTRIC COMPOSITIONS CONTAINING PHOTOACID GENERATOR AND BASE PROMERUS, LLC (US) 2017-06-01 — — US claimed
US-20160238932-A1 PHOTOIMAGEABLE POLYOLEFIN COMPOSITIONS CONTAINING PHOTOBASE GENERATORS SUMITOMO BAKELITE CO., LTD. (JP) 2016-08-18 — — US claimed
EP-4748893-A1 PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION Namics Corporation (JP) 2026-05-27 — — EP disclosed
CN-122095297-A Composition for forming cured film, alignment material, and phase difference material — 2026-05-26 — — CN disclosed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 — — WO disclosed
US-20140220483-A1 PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE DRY FILM, PATTERNING PROCESS, PROTECTIVE FILM, AND ELECTRIC/ELECTRONIC PART SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-08-07 — — US disclosed
US-20140045965-A1 ACTIVE RAY-CURABLE COMPOSITION, AND ACTIVE RAY-CURABLE INKJET PRINTING INK COMPOSITION AND ACTIVE RAY-CURABLE ADHESIVE COMPOSITION USING THE SAME TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2014-02-13 — — US disclosed
US-20140045965-A1 ACTIVE RAY-CURABLE COMPOSITION, AND ACTIVE RAY-CURABLE INKJET PRINTING INK COMPOSITION AND ACTIVE RAY-CURABLE ADHESIVE COMPOSITION USING THE SAME TOKYO UNIVERSITY OF SCIENCE FOUNDATION (JP) 2014-02-13 — — US disclosed
EP-2695921-A1 Active ray-curable composition, and active ray-curable inkjet printing ink composition and active ray-curable adhesive composition using the same Ricoh Company, Ltd. (JP) 2014-02-12 — — EP disclosed
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