SCHEMBL1554534

SCHEMBL1554534

Nc1c(C(=O)O)cc(Oc2cc(C(=O)O)c(N)c(C(=O)O)c2)cc1C(=O)O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 8/20 0.47
IDO1 P14902 1/20 0.42
POLB P06746 3/20 0.42
KMT2A Q03164 5/20 0.40
GFER P55789 1/20 0.40
RXFP1 Q9HBX9 1/20 0.40
ALDH1A1 P00352 5/20 0.39
MAPT P10636 4/20 0.39
MEN1 O00255 4/20 0.39
THRB P10828 3/20 0.39
TDP1 Q9NUW8 3/20 0.39
CYP3A4 P08684 3/20 0.39
RECQL P46063 2/20 0.39
CASP7 P55210 2/20 0.39
USP2 O75604 2/20 0.39
PKM P14618 2/20 0.39
MCL1 Q07820 2/20 0.39
CASP6 P55212 2/20 0.39
APEX1 P27695 1/20 0.39
BLM P54132 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1400225 0.87 CASP7 (0.47) KDM4EIDO1POLBKMT2AGFER
SCHEMBL664622 0.82 SMN1; SMN2 (0.50) KDM4EPOLBKMT2AALDH1A1MAPT
SCHEMBL8405155 0.77 KDM4E (0.58) KDM4EIDO1POLBKMT2AGFER
SCHEMBL4997223 0.77 KDM4E (0.56) KDM4EIDO1POLBKMT2AGFER
SCHEMBL712251 0.76 KDM4E (0.61) KDM4EIDO1POLBKMT2AGFER
SCHEMBL1551912 0.75 KDM4E (0.50) KDM4EPOLBKMT2AGFERRXFP1
SCHEMBL26963250 0.75 KDM4E (0.50) KDM4EIDO1POLBKMT2AGFER
SCHEMBL1554060 0.74 KMT2A (0.59) KDM4EIDO1POLBKMT2AGFER
SCHEMBL28704965 0.73 CYP3A4 (0.65) KDM4EPOLBKMT2AGFERRXFP1
SCHEMBL28902260 0.73 KDM4E (0.48) KDM4EIDO1POLBKMT2AGFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 78 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119775947-A Adhesive, and preparation method and application thereof 深圳市研一新材料有限责任公司 2025-04-08 CN claimed
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US claimed
CN-119775947-A Adhesive, and preparation method and application thereof 深圳市研一新材料有限责任公司 2025-04-08 CN disclosed
CN-119585651-A Composition for forming wavelength conversion film 日产化学株式会社 2025-03-07 CN disclosed
WO-2025047700-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM AND USE THEREOF 日産化学株式会社 2025-03-06 WO disclosed
WO-2025047702-A1 COMPOSITION FOR PATTERNING AND USE OF SAME 日産化学株式会社 2025-03-06 WO disclosed
WO-2024214539-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM, AND COMPOUND 日産化学株式会社 2024-10-17 WO disclosed
CN-118525024-A Condensed ring thiophene compound and composition for forming wavelength conversion film containing same 国立大学法人东海国立大学机构 2024-08-20 CN disclosed
CN-118318191-A Composition for forming wavelength conversion film 日产化学株式会社 2024-07-09 CN disclosed
CN-118192168-A Photosensitive resin composition 日产化学株式会社 2024-06-14 CN disclosed
WO-2024122572-A1 WAVELENGTH CONVERSION FILM-FORMING COMPOSITION AND FUSED THIOPHENE COMPOUND 日産化学株式会社 2024-06-13 WO disclosed
EP-1431822-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2004-06-23 EP disclosed
US-20040048188-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-03-11 US disclosed
CN-1468391-A Positive photosensitive polyimide resin composition �ղ���ѧ��ҵ��ʽ���� 2004-01-14 CN disclosed
US-6677099-B1 POLYAMIDEIMIDE DEVELOPED BY AN AQUEOUS ALKALINE SOLUTION AND WHICH IS EXCELLENT IN THE DEVELOPABILITY AND THE ADHESION TO A SUBSTRATE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-13 US disclosed
EP-1329769-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2003-07-23 EP disclosed
EP-1241527-A1 POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2002-09-18 EP disclosed
EP-0424940-B1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL IND LTD (JP) 1998-01-14 EP disclosed
US-5288588-A Containing diamine substituted with phenolic hydroxyl, carboxyl, thiophenol and/or sulfonic groups NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1994-02-22 US disclosed
EP-0424940-A2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1991-05-02 EP disclosed