Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TFPI2 | P48307 | 2/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | GMNN | O75496 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.32 |
| ▸ | THPO | P40225 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Formic Acid SCHEMBL28674353 | 0.87 | — | — | |
| SCHEMBL15770 | 0.87 | — | — | |
| SCHEMBL15980922 | 0.87 | — | — | |
| Bicarbonate SCHEMBL2015874 | 0.85 | TFPI2 (0.43) | TFPI2KDM4EGMNNLMNAPMP22 | |
| SCHEMBL16217683 | 0.82 | — | — | |
| SCHEMBL3548485 | 0.79 | PTGS1 (0.33) | — | |
| SCHEMBL15707736 | 0.78 | — | — | |
| Formic Acid SCHEMBL30917797 | 0.77 | PKM (0.41) | — | |
| SCHEMBL1904180 | 0.77 | CHRM5 (0.32) | — | |
| SCHEMBL5496141 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112088283-A | Refrigeration cycle device | 日立江森自控空调有限公司 | 2020-12-15 | — | — | CN | claimed |
| CN-117980404-A | Curable resin composition, coating layer, and film | 积水化学工业株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117242112-A | Curable resin composition, sealing agent for display element, sealing agent for organic EL display element, optical adhesive, and optical member | 积水化学工业株式会社 | 2023-12-15 | — | — | CN | disclosed |
| CN-112513132-B | Ester resin and method for producing ester resin | 哈利玛化成株式会社 | 2023-07-11 | — | — | CN | disclosed |
| CN-114901759-B | Cross-linking agent composition for aqueous resin and aqueous resin composition | 日清纺化学株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-113444425-B | Water-based epoxy fireproof coating and preparation method and application thereof | 海洋化工研究院有限公司 | 2022-03-22 | — | — | CN | disclosed |
| CN-113444425-A | Water-based epoxy fireproof coating and preparation method and application thereof | 海洋化工研究院有限公司 | 2021-09-28 | — | — | CN | disclosed |
| CN-111732870-A | Low-shrinkage high-weather-resistance epoxy anticorrosive fireproof coating containing expansion monomer and preparation process thereof | 上海暄洋化工材料科技有限公司 | 2020-10-02 | — | — | CN | disclosed |
| US-8652641-B2 | Heat conductive dielectric polymer material and heat dissipation substrate containing the same | POLYTRONICS TECHNOLOGY CORP. (TW) | 2014-02-18 | — | — | US | disclosed |
| US-20130062045-A1 | HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME | POLYTRONICS TECHNOLOGY CORP. (TW) | 2013-03-14 | — | — | US | disclosed |
| US-20110214852-A1 | HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME | POLYTRONICS TECHNOLOGY CORP. (TW) | 2011-09-08 | — | — | US | disclosed |
| US-20110217462-A1 | METHODS FOR MANUFACTURING INSULATED HEAT CONDUCTIVE SUBSTRATE AND INSULATED HEAT CONDUCTIVE COMPOSITE SUBSTRATE | POLYTRONICS TECHNOLOGY CORP. (TW) | 2011-09-08 | — | — | US | disclosed |
| US-8003216-B2 | Heat-conductive dielectric polymer material and heat dissipation substrate containing the same | POLYTRONICS TECHNOLOGY CORPORATION (TW) | 2011-08-23 | — | — | US | disclosed |
| US-20080073623-A1 | Heat-conductive dielectric polymer material and heat dissipation substrate containing the same | POLYTRONICS TECHNOLOGY CORPORATION | 2008-03-27 | — | — | US | disclosed |