SCHEMBL1578024

SCHEMBL1578024

O=NN1CCCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL105009 1.00 ALDH1A1 (0.32)
SCHEMBL29390792 1.00 ALDH1A1 (0.32)
SCHEMBL605035 1.00
SCHEMBL606668 0.96
SCHEMBL31423403 0.93
SCHEMBL11507080 0.89
SCHEMBL28712015 0.87 CA1 (0.35)
SCHEMBL18650288 0.86
N,N'-Dinitrosopiperazine SCHEMBL2353649 0.81
SCHEMBL3262072 0.81

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8623967-B2 Polymers functionalized with nitroso compounds BRIDGESTONE CORPORATION (JP) 2014-01-07 US claimed
US-20130096264-A1 POLYMERS FUNCTIONALIZED WITH NITROSO COMPOUNDS BRIDGESTONE CORPORATION (JP) 2013-04-18 US claimed
US-8188195-B2 Polymers functionalized with nitroso compounds BRIDGESTONE CORPORATION (JP) 2012-05-29 US claimed
US-20100168378-A1 POLYMERS FUNCTIONALIZED WITH NITROSO COMPOUNDS BRIDGESTONE CORPORATION (JP) 2010-07-01 US claimed
WO-2025105331-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2025-05-22 WO disclosed
US-20250068074-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-02-27 US disclosed
US-12174539-B2 Negative photosensitive resin composition, production method for polyimide, production method for cured relief pattern, and semiconductor device ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-12-24 US disclosed
WO-2024204120-A1 ACTIVE ENERGY RAY-CURABLE RELEASE-TYPE ADHESIVE AGENT COMPOSITION AND ADHESIVE SHEET 三菱ケミカル株式会社 2024-10-03 WO disclosed
CN-118363270-A Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2024-07-19 CN disclosed
US-20220291585-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2022-09-15 US disclosed
EP-4006073-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE Asahi Kasei Kabushiki Kaisha (JP) 2022-06-01 EP disclosed
CN-114207522-A Negative photosensitive resin composition, method for producing polyimide, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-03-18 CN disclosed
WO-2006135602-A2 HERPES VIRUS-BASED COMPOSITIONS AND METHODS OF USE IN THE PRENATAL AND PERINATAL PERIODS UNIVERSITY OF ROCHESTER (US) 2006-12-21 WO disclosed
EP-0249452-B1 PROCESS FOR PRODUCING N-AMINOHEXAMETHYLENEIMINE UBE INDUSTRIES, LTD. (JP) 1990-11-07 EP disclosed
US-4877874-A Process for producing N-aminohexamethyleneimine UBE INDRUSTRIES, LTD. (JP) 1989-10-31 US disclosed
EP-0249452-A1 Process for producing N-aminohexamethyleneimine UBE INDUSTRIES, LTD. (JP) 1987-12-16 EP disclosed
US-4221788-A 2-(Optionally-substituted)benzylperhydroazepines for analgesia and lowering blood pressure BYK GULDEN LOMBERG CHEMISCHE FABRIK GMBH (DE) 1980-09-09 US disclosed
US-4166169-A POLYMERIZABLE POLYACRYLIC ESTERS FELT PRODUCTS MFG. CO. (US) 1979-08-28 US disclosed
US-4090997-A High-strength anaerobic sealant composition and method of preparation FELT PRODUCTS MFG. CO. (US) 1978-05-23 US disclosed
US-3957823-A METALLIZATION BADISCHE ANILIN- & SODA-FABRIK AKTIENGESELLSCHAFT (DT) 1976-05-18 US disclosed