Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 1/20 | 0.48 |
| ▸ | TSHR | P16473 | 5/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.46 |
| ▸ | POLB | P06746 | 3/20 | 0.36 |
| ▸ | APEX1 | P27695 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.34 |
| ▸ | CA1 | P00915 | 3/20 | 0.32 |
| ▸ | CA2 | P00918 | 3/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Oxirane SCHEMBL170556 | 0.98 | THRB (0.50) | THRBTSHRALDH1A1POLBAPEX1 | |
| Methacrylic Acid SCHEMBL27539985 | 0.93 | THRB (0.46) | THRBTSHRALDH1A1POLBAPEX1 | |
| Tetrahydrofuran SCHEMBL5508826 | 0.93 | TSHR (0.49) | THRBTSHRALDH1A1POLBAPEX1 | |
| SCHEMBL14648232 | 0.92 | THRB (0.48) | THRBTSHRALDH1A1POLBAPEX1 | |
| SCHEMBL9419658 | 0.91 | TSHR (0.47) | THRBTSHRALDH1A1POLBAPEX1 | |
| Dioxane SCHEMBL3323024 | 0.90 | THRB (0.59) | THRBTSHRALDH1A1POLBAPEX1 | |
| Oxirane SCHEMBL3776781 | 0.88 | THRB (0.61) | THRBTSHRALDH1A1POLBAPEX1 | |
| SCHEMBL29229747 | 0.88 | THRB (0.59) | THRBTSHRALDH1A1POLBAPEX1 | |
| SCHEMBL14886 | 0.88 | — | — | |
| SCHEMBL6864388 | 0.88 | THRB (0.59) | THRBTSHRALDH1A1POLBAPEX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 334 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024101358-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | 株式会社レゾナック | 2024-05-16 | — | — | WO | claimed |
| WO-2024100764-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR ELEMENT | 株式会社レゾナック | 2024-05-16 | — | — | WO | claimed |
| US-20220173479-A1 | Polyolefin Separator and Method for Manufacturing the Same | LG CHEM, LTD. (KR) | 2022-06-02 | — | — | US | claimed |
| EP-3937275-A1 | POLYOLEFIN SEPARATOR AND METHOD FOR PRODUCING SAME | LG CHEM, LTD. (KR) | 2022-01-12 | — | — | EP | claimed |
| WO-2020197198-A1 | POLYOLEFIN SEPARATOR AND METHOD FOR PRODUCING SAME | 주식회사 엘지화학 | 2020-10-01 | — | — | WO | claimed |
| EP-2040259-B1 | ULTRAVIOLET-CURABLE RESIN COMPOSITION AND USE THEREOF | NIPPON KAYAKU KK (JP) | 2012-09-05 | — | — | EP | claimed |
| US-8192821-B2 | Ultraviolet-curable resin composition and use thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2012-06-05 | — | — | US | claimed |
| US-20090155516-A1 | Ultraviolet-Curable Resin Composition and Use Thereof | NIPPON KAYAKU KABUSHIKIKAISHA (JP) | 2009-06-18 | — | — | US | claimed |
| EP-2040259-A1 | ULTRAVIOLET-CURABLE RESIN COMPOSITION AND USE THEREOF | Nippon Kayaku Kabushiki Kaisha (JP) | 2009-03-25 | — | — | EP | claimed |
| EP-0346486-B1 | RESIN COMPOSITION AND SOLDER RESIST RESIN COMPOSITION | NIPPON KAYAKU KK (JP) | 1995-10-25 | — | — | EP | claimed |
| EP-0346486-A1 | RESIN COMPOSITION AND SOLDER RESIST RESIN COMPOSITION | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1989-12-20 | — | — | EP | claimed |
| US-20240243000-A1 | ADHESIVE SHEET FOR BACKGRINDING, SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SUBSTRATE SHEET | DISCO CORPORATION (JP) | 2024-07-18 | — | — | US | disclosed |
| WO-2024143273-A1 | RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143274-A1 | SUPPORT BODY-EQUIPPED RESIN FILM, MANUFACTURING METHOD FOR PRINTED WIRING BOARD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143279-A1 | RESIN COMPOSITION, RESIN FILM, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2024-07-04 | — | — | WO | disclosed |
| US-20020173589-A1 | Acrylic syrup and method of producing same | MITSUBISHI GAS CHEMICAL COMPANY, INC. | 2002-11-21 | — | — | US | disclosed |
| EP-1258501-A2 | Acrylic syrup and method of producing the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2002-11-20 | — | — | EP | disclosed |
| EP-0346486-B1 | RESIN COMPOSITION AND SOLDER RESIST RESIN COMPOSITION | NIPPON KAYAKU KK (JP) | 1995-10-25 | — | — | EP | disclosed |
| US-5215863-A | Epoxy resin; acrylated epoxy resins; maleic anhydride-styrene copolymer; photo-polymerization initiator | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1993-06-01 | — | — | US | disclosed |
| EP-0346486-A1 | RESIN COMPOSITION AND SOLDER RESIST RESIN COMPOSITION | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1989-12-20 | — | — | EP | disclosed |