SCHEMBL15859564

SCHEMBL15859564

CCCCC(CC)(OO)C(=O)OC(C)(C)C

nearest known ligand 0.34

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
DGAT1 O75907 1/20 0.34
ALDH1A1 P00352 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
CTSK P43235 2/20 0.31
GAA P10253 1/20 0.31
LMNA P02545 1/20 0.30
CTSS P25774 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2491462 0.88
SCHEMBL28960878 0.86 MEN1 (0.38) L3MBTL1
SCHEMBL717671 0.86 DGAT1 (0.34) DGAT1CTSKCTSS
SCHEMBL20210944 0.85 DGAT1 (0.41) DGAT1ALDH1A1GAA
SCHEMBL28752538 0.84 DGAT1 (0.33) DGAT1CTSK
SCHEMBL21410453 0.83
SCHEMBL31490140 0.81 CTSK (0.35) DGAT1ALDH1A1L3MBTL1CTSKCTSS
SCHEMBL8000041 0.81 DGAT1 (0.32) DGAT1
SCHEMBL31269598 0.76 CYP4F2 (0.46) DGAT1ALDH1A1L3MBTL1CTSKCTSS
SCHEMBL10457501 0.76 CYP4F2 (0.42) DGAT1ALDH1A1L3MBTL1CTSKCTSS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114514269-A Very soft EVA foam and method thereof 布拉斯科有限公司 2022-05-17 CN disclosed
US-20140193744-A1 HEAT-CURABLE RESIN COMPOSITION, PRODUCTION METHOD OF CURED ARTICLE AND MOLDED ARTICLE OF THE SAME, CURED ARTICLE, MOLDED ARTICLE, AND SEPARATOR FOR A FUEL CELL SHOWA DENKO K.K. (JP) 2014-07-10 US disclosed
EP-2752463-A1 HEAT-CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING CURED ARTICLE AND MOLDED ARTICLE THEREOF, CURED ARTICLE, MOLDED ARTICLE, AND SEPARATOR FOR FUEL CELL Showa Denko K.K. (JP) 2014-07-09 EP disclosed