SCHEMBL1593543

SCHEMBL1593543

COC(Cl)C1CCC(C(Cl)OC)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2000549 0.86 SHBG (0.39)
SCHEMBL129698 0.67
SCHEMBL19121793 0.67
SCHEMBL12409013 0.67
SCHEMBL15417357 0.67
SCHEMBL8734417 0.67
SCHEMBL6301429 0.62
SCHEMBL13953080 0.62
SCHEMBL745739 0.62
SCHEMBL8882235 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8741538-B2 Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2014-06-03 US disclosed
EP-1736485-B1 POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO LTD (JP) 2013-07-31 EP disclosed
US-8304163-B2 Compound, dissolution inhibitor, positive type resist composition, and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-11-06 US disclosed
US-7943284-B2 Compound, dissolution inhibitor, positive type resist composition, and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2011-05-17 US disclosed
US-20110091810-A1 COMPOUND, DISSOLUTION INHIBITOR, POSITIVE TYPE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2011-04-21 US disclosed
US-20100151383-A1 POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2010-06-17 US disclosed
US-7700259-B2 Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-04-20 US disclosed
US-20090081580-A1 COMPOUND, DISSOLUTION INHIBITOR, POSITIVE TYPE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD (JP) 2009-03-26 US disclosed
US-20070224520-A1 Polymer Compound, Photoresist Composition Containing Such Polymer Compound, and Method for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2007-09-27 US disclosed
EP-1736485-A1 POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2006-12-27 EP disclosed