SCHEMBL1594960

SCHEMBL1594960

Cc1cc(C(CCC(c2ccc(O)c(C)c2)c2ccc(O)c(C)c2)c2ccc(O)c(C)c2)ccc1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 12/20 0.48
ESR2 Q92731 9/20 0.48
TP53 P04637 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
AR P10275 5/20 0.45
PDE10A Q9Y233 1/20 0.45
TRPA1 O75762 1/20 0.42
PTGS1 P23219 1/20 0.42
CACNA1C Q13936 1/20 0.42
KDM4E B2RXH2 1/20 0.39
ALDH1A1 P00352 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
MAPT P10636 1/20 0.39
G6PD P11413 1/20 0.39
CYP2C9 P11712 1/20 0.39
PKM P14618 1/20 0.39
HPGD P15428 1/20 0.39
ALOX15 P16050 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31222316 1.00 ESR1 (0.48) ESR1ESR2TP53TDP1AR
SCHEMBL17803638 0.92 ESR1 (0.42) ESR1ESR2TP53TDP1AR
SCHEMBL1595673 0.92 ESR1 (0.45) ESR1ESR2TP53TDP1AR
SCHEMBL68663 0.90 ESR1 (0.47) ESR1ESR2TP53TDP1AR
SCHEMBL9001589 0.90 ESR1 (0.44) ESR1ESR2TP53TDP1AR
SCHEMBL10430019 0.90 ESR1 (0.44) ESR1ESR2TP53TDP1AR
SCHEMBL1596462 0.87 ESR1 (0.48) ESR1ESR2TP53TDP1AR
SCHEMBL30343453 0.87 ESR1 (0.48) ESR1ESR2TP53TDP1AR
SCHEMBL5301206 0.87 ESR1 (0.50) ESR1ESR2TP53TDP1AR
SCHEMBL4238026 0.85 ESR1 (0.40) ESR1ESR2TP53TDP1AR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12187843-B2 Liquid compression molding or encapsulant compositions HENKEL AG & CO. KGAA (DE) 2025-01-07 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210163674-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-03 US disclosed
US-10851201-B2 Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering HUNTSMAN INTERNATIONAL LLC (US) 2020-12-01 US disclosed
EP-3298061-B1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) 2020-09-09 EP disclosed
US-20180142058-A1 A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering HUNTSMAN INTERNATIONAL LLC (US) 2018-05-24 US disclosed
EP-2489689-B1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NIPPON SODA CO (JP) 2017-05-10 EP disclosed
CN-103648275-B Shaped-tablet slime remover 日本曹达株式会社 2017-02-15 CN disclosed
EP-1767090-B1 CLATHRATE COMPOUND, METHOD OF CONTROLLING CONCENTRATION OF AQUEOUS SOLUTION OF AGRICULTURAL-CHEMICAL ACTIVE INGREDIENT, AND AGRICULTURAL-CHEMICAL PREPARATION NIPPON SODA CO (JP) 2015-08-12 EP disclosed
US-9068074-B2 Composition for formation of cured epoxy resin, and cured products thereof NIPPON SODA CO., LTD. (JP) 2015-06-30 US disclosed
US-6528467-B1 Clathrates such as 5-chloro-2-methyl-4-isothiazolin-3-one and pressure molded 1,1-bis(4-hydroxyphenyl)cyclohexane host compounds, used for unclogging drains NIPPON SODA CO., LTD. (JP) 2003-03-04 US disclosed
US-20030032569-A1 Slime remover and slime preventing/removing agent NIPPON SODA CO., LTD. 2003-02-13 US disclosed
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound NIPPON SODA CO., LTD. (JP) 2002-12-19 US disclosed
EP-1241230-A1 MOLECULAR COMPOUND COMPRISING POLYMER HAVING HYDROGEN BOND AS COMPONENT COMPOUND NIPPON SODA CO., LTD. (JP) 2002-09-18 EP disclosed
EP-1113112-A1 SLIME REMOVER AND SLIME PREVENTING/REMOVING AGENT NIPPON SODA CO., LTD. (JP) 2001-07-04 EP disclosed
US-6147169-A LOW TEMPERATURE CURING MIXTURE OF REACTIVE BASE RESIN AND A CLATHRATE COMPRISING A TETRAKISPHENOL HOSTING A CURING AGENT OR CURING CATALYST; STORAGE STABILITY, CORROSION RESISTANCE, ADHESION KANSAI PAINT CO., LTD. (JP) 2000-11-14 US disclosed
EP-0949286-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 1999-10-13 EP disclosed
EP-0589044-B1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO (JP) 1996-10-23 EP disclosed
US-5364977-A Chemical stabilization and powder processing NIPPON SODA CO., LTD. (JP) 1994-11-15 US disclosed
EP-0589044-A1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO., LTD. (JP) 1994-03-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound PIEZO1, PARN, PARG ESR1 1071/4885ESR2 1617/4885TP53 3688/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.