SCHEMBL15965347

SCHEMBL15965347

CN(C)c1ccc(OCCC[SiH3])cc1

nearest known ligand 0.53

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
APP P05067 9/20 0.53
PTGES O14684 1/20 0.51
HDAC1 Q13547 1/20 0.51
CHKA P35790 1/20 0.47
ALDH1A1 P00352 4/20 0.44
KDM4E B2RXH2 3/20 0.44
TSHR P16473 2/20 0.44
HSD17B10 Q99714 2/20 0.44
MAPT P10636 1/20 0.44
RAB9A P51151 1/20 0.44
MCL1 Q07820 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
ALOX15 P16050 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1263730 0.83 PTGES (0.68) APPPTGESHDAC1CHKAALDH1A1
SCHEMBL595602 0.80 APP (0.61) APPPTGESHDAC1CHKAALDH1A1
SCHEMBL11020409 0.80 APP (0.57) APPPTGESHDAC1CHKAALDH1A1
SCHEMBL19958267 0.79 APP (0.70) APPPTGESHDAC1CHKAALDH1A1
SCHEMBL1263098 0.79 ALDH1A1 (0.62) APPPTGESHDAC1CHKAALDH1A1
SCHEMBL23302979 0.78 PTGES (0.62) APPPTGESHDAC1ALDH1A1KDM4E
SCHEMBL11020593 0.78 APP (0.56) APPPTGESHDAC1CHKAALDH1A1
SCHEMBL1263398 0.78 PTGES (0.62) APPPTGESHDAC1ALDH1A1KDM4E
SCHEMBL11001964 0.78 PTGES (0.62) APPPTGESHDAC1ALDH1A1KDM4E
SCHEMBL7866225 0.78 HDAC1 (0.54) APPPTGESHDAC1CHKAALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9315670-B2 Composition for forming resist underlayer film and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-19 US disclosed
US-20140235796-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-08-21 US disclosed