SCHEMBL15965787

SCHEMBL15965787

CCCCCCCCOc1cc(N2C(=O)c3ccc4c5ccc6c7c(ccc(c8ccc(c3c48)C2=O)c75)C(=O)N(c2cc(C)c(C)c(C)c2)C6=O)cc(OCCCCCCCC)c1OCCCCCCCC

nearest known ligand 0.38

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 2/20 0.38
▸ MAPT P10636 2/20 0.38
▸ KDM4E B2RXH2 1/20 0.38
▸ LMNA P02545 1/20 0.38
▸ NPSR1 Q6W5P4 1/20 0.38
▸ MEN1 O00255 2/20 0.34
▸ KMT2A Q03164 2/20 0.34
▸ THRB P10828 1/20 0.34
▸ SMPD1 P17405 4/20 0.34
▸ CNR2 P34972 1/20 0.34
▸ TP53 P04637 1/20 0.33
▸ S1PR5 Q9H228 2/20 0.33
▸ PPARG P37231 1/20 0.33
▸ PPARD Q03181 1/20 0.33
▸ PPARA Q07869 1/20 0.33
▸ STAT3 P40763 1/20 0.32
▸ HIF1A Q16665 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14827380 0.83 MAPT (0.35) ALDH1A1MAPTKDM4ELMNANPSR1
SCHEMBL14827382 0.83 MAPT (0.35) ALDH1A1MAPTKDM4ELMNANPSR1
SCHEMBL14706336 0.82 PPARG (0.36) ALDH1A1MAPTLMNAMEN1KMT2A
SCHEMBL14706337 0.82 THRA (0.35) ALDH1A1MAPTKDM4ELMNANPSR1
SCHEMBL14706338 0.81 GAA (0.38) ALDH1A1MAPTKDM4EMEN1KMT2A
SCHEMBL14706353 0.78 MAPT (0.38) ALDH1A1MAPTLMNAMEN1KMT2A
SCHEMBL14074461 0.78 CNR2 (0.40) ALDH1A1MAPTKDM4ELMNANPSR1
SCHEMBL12869345 0.77 THRB (0.34) ALDH1A1MAPTKDM4ELMNANPSR1
SCHEMBL14706342 0.77 MEN1 (0.33) ALDH1A1MAPTKDM4ELMNANPSR1
SCHEMBL14706340 0.77 MCHR1 (0.32) ALDH1A1MAPTKDM4ELMNANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160013392-A1 METHOD OF PRODUCING THERMOELECTRIC CONVERSION ELEMENT AND METHOD OF PREPARATION DISPERSION FOR THERMOELECTRIC CONVERSION LAYER FUJIFILM CORPORATION (JP) 2016-01-14 — — US disclosed
US-20140251407-A1 THERMOELECTRIC CONVERSION MATERIAL AND A THERMOELECTRIC CONVERSION ELEMENT FUJIFILM CORPORATION (JP) 2014-09-11 — — US disclosed
US-20140230871-A1 THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION ELEMENT FUJIFILM CORPORATION (JP) 2014-08-21 — — US disclosed
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