SCHEMBL15966166

SCHEMBL15966166

c1ccc2c(c1)-c1ccccc1C2(c1ccc(-c2ccc(OCC3CO3)cc2)cc1)c1ccc(-c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.54
MEN1 O00255 4/20 0.47
KMT2A Q03164 4/20 0.47
ALDH1A1 P00352 4/20 0.45
TP53 P04637 3/20 0.45
TSHR P16473 3/20 0.45
HIF1A Q16665 2/20 0.45
SMN1; SMN2 Q16637 2/20 0.45
CYP3A4 P08684 1/20 0.45
MAPT P10636 4/20 0.44
HPGD P15428 2/20 0.44
LMNA P02545 2/20 0.44
PKM P14618 2/20 0.44
CYP1A2 P05177 1/20 0.44
PPARG P37231 1/20 0.44
GAA P10253 1/20 0.44
KDM4E B2RXH2 1/20 0.41
OPRK1 P41145 1/20 0.41
GLA P06280 1/20 0.40
FGFR1 P11362 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30044297 0.96 TDP1 (0.58) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL157321 0.96 TDP1 (0.58) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL13827403 0.96 TDP1 (0.58) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL29386530 0.96 TDP1 (0.58) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL15700021 0.96 TDP1 (0.58) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL20411194 0.93 TDP1 (0.59) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL23153041 0.90 TDP1 (0.51) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL4128580 0.90 TDP1 (0.51) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL11950517 0.90 TDP1 (0.51) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL21829149 0.89 TDP1 (0.41) TDP1MEN1KMT2AALDH1A1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105122137-B Photosensitive resin composition, protective film or insulating film, touch panel, and method for producing same 东丽株式会社 2020-02-07 CN disclosed
WO-2014125884-A1 PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM OR INSULATION FILM OBTAINED BY HEAT CURING SAID COMPOSITION, TOUCH PANEL USING SAID FILM, AND PRODUCTION METHOD FOR SAID TOUCH PANEL 東レ株式会社 (JP) 2014-08-21 WO disclosed