Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | CYP19A1 | P11511 | 3/20 | 0.33 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.31 |
| ▸ | NR4A1 | P22736 | 1/20 | 0.30 |
| ▸ | APP | P05067 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8813462 | 0.86 | CHRM2 (0.33) | TDP1MAPK1ALDH1A1CYP3A4 | |
| SCHEMBL18938582 | 0.85 | CHRM2 (0.33) | TDP1MAPK1ALDH1A1 | |
| SCHEMBL5155322 | 0.80 | TSHR (0.32) | TDP1 | |
| SCHEMBL110157 | 0.80 | TDP1 (0.46) | TDP1MAPK1ALDH1A1CYP3A4CYP19A1 | |
| SCHEMBL6567041 | 0.76 | TSHR (0.49) | MAPK1ALDH1A1CYP3A4CYP19A1APP | |
| SCHEMBL9491840 | 0.75 | LMNA (0.40) | ALDH1A1 | |
| SCHEMBL15124 | 0.75 | LMNA (0.40) | ALDH1A1 | |
| SCHEMBL3660228 | 0.74 | TSHR (0.41) | TDP1ALDH1A1 | |
| Ammonia Solution, Strong SCHEMBL5682705 | 0.73 | LMNA (0.39) | — | |
| Bromide SCHEMBL10785570 | 0.73 | LMNA (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10608136-B2 | Method of bonding semiconductor elements and junction structure | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) | 2020-03-31 | — | — | US | disclosed |
| US-20140238485-A1 | Method of Bonding Semiconductor Elements and Junction Structure | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE & TECHNOLOGY (JP) | 2014-08-28 | — | — | US | disclosed |
| EP-2770540-A1 | SEMICONDUCTOR ELEMENT BONDING METHOD AND BONDING STRUCTURE | National Institute of Advanced Industrial Science And Technology (JP) | 2014-08-27 | — | — | EP | disclosed |