SCHEMBL1596800

SCHEMBL1596800

Oc1ccc(C(CCC(c2ccc(O)c(Br)c2)c2ccc(O)c(Br)c2)c2ccc(O)c(Br)c2)cc1Br

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 2/20 0.48
CYP19A1 P11511 5/20 0.45
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
GAA P10253 1/20 0.42
FOLH1 Q04609 1/20 0.39
ALOX12 P18054 1/20 0.36
MAPT P10636 2/20 0.35
HPGD P15428 2/20 0.35
APEX1 P27695 2/20 0.35
RECQL P46063 2/20 0.35
BLM P54132 2/20 0.35
TDP1 Q9NUW8 2/20 0.35
LMNA P02545 1/20 0.35
ADRB2 P07550 1/20 0.35
ADRB1 P08588 1/20 0.35
ADRA2A P08913 1/20 0.35
ADORA3 P0DMS8 1/20 0.35
ADRB3 P13945 1/20 0.35
DRD2 P14416 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30343457 1.00 ALOX15 (0.48) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL1597046 0.92 ALOX15 (0.45) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL11528740 0.88 ALOX15 (0.42) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL1595390 0.87 ALOX15 (0.48) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL30343448 0.87 ALOX15 (0.48) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL11390355 0.84 ALOX15 (0.40) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL3190368 0.83 BCHE (0.45) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL5710162 0.82 ESR1 (0.42) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL4460187 0.79 GAA (0.54) ALOX15CYP19A1MEN1KMT2AGAA
SCHEMBL30343461 0.79 ALOX15 (0.54) ALOX15CYP19A1MEN1KMT2AGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12187843-B2 Liquid compression molding or encapsulant compositions HENKEL AG & CO. KGAA (DE) 2025-01-07 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210163674-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-03 US disclosed
US-10851201-B2 Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering HUNTSMAN INTERNATIONAL LLC (US) 2020-12-01 US disclosed
EP-3298061-B1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) 2020-09-09 EP disclosed
US-20180142058-A1 A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering HUNTSMAN INTERNATIONAL LLC (US) 2018-05-24 US disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
EP-2489689-B1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NIPPON SODA CO (JP) 2017-05-10 EP disclosed
WO-2016087935-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2016-06-09 WO disclosed
EP-1520867-A2 Curatives for epoxy resin, curing accelerator, and epoxy resin composition NIPPON SODA CO., LTD. (JP) 2005-04-06 EP disclosed
EP-0949286-B1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO (JP) 2005-03-02 EP disclosed
US-20040106764-A1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition SUZUKI HIROSHI (JP) 2004-06-03 US disclosed
US-6727325-B1 HEAT RESISTANCE, STABILITY, POT LIFE; ONE-PACK MIXTURES; LOW TEMPERATURE CURABILITY NIPPON SODA CO. LTD. (JP) 2004-04-27 US disclosed
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound NIPPON SODA CO., LTD. (JP) 2002-12-19 US disclosed
EP-1241230-A1 MOLECULAR COMPOUND COMPRISING POLYMER HAVING HYDROGEN BOND AS COMPONENT COMPOUND NIPPON SODA CO., LTD. (JP) 2002-09-18 EP disclosed
EP-0949286-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 1999-10-13 EP disclosed
EP-0589044-B1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO (JP) 1996-10-23 EP disclosed
US-5364977-A Chemical stabilization and powder processing NIPPON SODA CO., LTD. (JP) 1994-11-15 US disclosed
EP-0589044-A1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO., LTD. (JP) 1994-03-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound PIEZO1, PARN, PARG ALOX15 2840/4885CYP19A1 3797/4885MEN1 2108/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.