Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD11B1 | P28845 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14949900 | 1.00 | HSD11B1 (0.31) | HSD11B1 | |
| SCHEMBL16605700 | 0.81 | — | — | |
| SCHEMBL25878992 | 0.81 | — | — | |
| SCHEMBL26073691 | 0.78 | — | — | |
| SCHEMBL9537843 | 0.75 | — | — | |
| SCHEMBL13398885 | 0.73 | KDM4E (0.35) | — | |
| SCHEMBL14114656 | 0.73 | — | — | |
| SCHEMBL10335733 | 0.73 | — | — | |
| SCHEMBL13818194 | 0.73 | KDM4E (0.31) | — | |
| SCHEMBL25878991 | 0.73 | KDM4E (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3450499-B1 | COMPOSITION FOR CURABLE RESIN, AND CURED PRODUCT THEREOF | ENEOS CORP (JP) | 2023-11-01 | — | — | EP | disclosed |
| US-9905768-B2 | Semiconductor device and insulating layer-forming composition | FUJIFILM CORPORATION (JP) | 2018-02-27 | — | — | US | disclosed |
| US-20170054076-A1 | SEMICONDUCTOR DEVICE AND INSULATING LAYER-FORMING COMPOSITION | FUJIFILM CORPORATION (JP) | 2017-02-23 | — | — | US | disclosed |
| US-20170054076-A1 | SEMICONDUCTOR DEVICE AND INSULATING LAYER-FORMING COMPOSITION | FUJIFILM CORPORATION (JP) | 2017-02-23 | — | — | US | disclosed |
| US-20170005266-A1 | SEMICONDUCTOR ELEMENT AND INSULATING LAYER-FORMING COMPOSITION | FUJIFILM CORPORATION (JP) | 2017-01-05 | — | — | US | disclosed |
| US-20170005266-A1 | SEMICONDUCTOR ELEMENT AND INSULATING LAYER-FORMING COMPOSITION | FUJIFILM CORPORATION (JP) | 2017-01-05 | — | — | US | disclosed |
| US-9400430-B2 | Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film, mask blank and method of forming pattern | FUJIFILM CORPORATION (JP) | 2016-07-26 | — | — | US | disclosed |
| US-9400430-B2 | Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film, mask blank and method of forming pattern | FUJIFILM CORPORATION (JP) | 2016-07-26 | — | — | US | disclosed |
| US-20140242502-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, MASK BLANK AND METHOD OF FORMING PATTERN | FUJIFILM CORPORATION (JP) | 2014-08-28 | — | — | US | disclosed |
| US-20140242502-A1 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, MASK BLANK AND METHOD OF FORMING PATTERN | FUJIFILM CORPORATION (JP) | 2014-08-28 | — | — | US | disclosed |