SCHEMBL26073691

SCHEMBL26073691

C1CC2OC2CC1C1CC2OC2CC1C1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL468361 0.81
SCHEMBL106572 0.81
SCHEMBL14396172 0.81
SCHEMBL15739097 0.81
SCHEMBL5604565 0.79
SCHEMBL14949900 0.78 HSD11B1 (0.31)
SCHEMBL15978727 0.78 HSD11B1 (0.31)
SCHEMBL5685508 0.78
SCHEMBL15980921 0.75 TFPI2 (0.33)
SCHEMBL658709 0.75 TFPI2 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230307407-A1 MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METHOD FOR FORMING CONDUCTIVE LAYER RICOH COMPANY, LTD. (JP) 2023-09-28 US disclosed