SCHEMBL16007690

SCHEMBL16007690

CCO[Si](CCCCC1CC2CCC1C2)(OCC)OCC

nearest known ligand 0.35

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.31
OPRK1 P41145 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16007365 0.98 EPHX2 (0.31) EPHX2OPRK1
SCHEMBL16007781 0.95 EPHX2 (0.32) EPHX2OPRK1
SCHEMBL16007805 0.89 EPHX2 (0.33) EPHX2OPRK1
SCHEMBL16007813 0.85 EPHX2 (0.30) EPHX2OPRK1
SCHEMBL16007750 0.84 LMNA (0.34) OPRK1
SCHEMBL16007804 0.83 LMNA (0.34) EPHX2OPRK1
SCHEMBL16007865 0.79 LMNA (0.35) OPRK1
SCHEMBL16007634 0.78 EPHX2 (0.33) EPHX2OPRK1
SCHEMBL3447574 0.77 MEN1 (0.39) EPHX2OPRK1
SCHEMBL16007797 0.75 LMNA (0.33) OPRK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8975350-B2 Polymerizable composition, resin moldings and manufacturing process therefor, and laminates ZEON CORPORATION (JP) 2015-03-10 US disclosed
US-20140256878-A1 POLYMERIZABLE COMPOSITION, RESIN MOLDINGS AND MANUFACTURING PROCESS THEREFOR, AND LAMINATES ZEON CORPORATION (JP) 2014-09-11 US disclosed
CN-103717671-A Polymerizable composition, resin moldings and manufacturing process therefor, and laminates ZEON CORP 2014-04-09 CN disclosed