Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2D6 | P10635 | 2/20 | 0.40 |
| ▸ | TSHR | P16473 | 2/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.40 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.40 |
| ▸ | THPO | P40225 | 1/20 | 0.40 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.39 |
| ▸ | GMNN | O75496 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | MAPT | P10636 | 1/20 | 0.39 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | TP53 | P04637 | 1/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | BLM | P54132 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
| ▸ | CA1 | P00915 | 1/20 | 0.30 |
| ▸ | CA2 | P00918 | 1/20 | 0.30 |
| ▸ | NT5E | P21589 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1155684 | 0.74 | — | — | |
| SCHEMBL6946803 | 0.74 | — | — | |
| SCHEMBL167374 | 0.74 | — | — | |
| SCHEMBL3391834 | 0.74 | TP53 (0.35) | TP53 | |
| SCHEMBL14955405 | 0.73 | TP53 (0.37) | TP53CA5ACA5B | |
| SCHEMBL14955034 | 0.73 | TP53 (0.42) | PMP22TP53CA5ACA5B | |
| SCHEMBL1961611 | 0.72 | — | — | |
| SCHEMBL1959272 | 0.72 | — | — | |
| SCHEMBL1962788 | 0.72 | — | — | |
| Ammonia Solution, Strong SCHEMBL2160220 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1152071-B1 | Copper plating method | ELECTROPLATING ENG (JP) | 2005-09-07 | — | — | EP | claimed |
| EP-0907767-B1 | CYANIDE-FREE ELECTROPLATING BATH FOR DEPOSITION OF GOLD AND GOLD ALLOYS | DEGUSSA GALVANOTECHNIK GMBH (DE) | 2002-02-13 | — | — | EP | claimed |
| EP-1152071-A1 | Copper plating method | Electroplating Engineers of Japan Limited (JP) | 2001-11-07 | — | — | EP | claimed |
| US-6165342-A | CONTAINING SULPHUROUS GOLD COMPLEXES THAT ARE RELATIVELY STABLE AND ODOR-FREE, OBTAINED WHEN THE SULPHUROUS COMPOUNDS USED ARE MERCAPTOSULFONIC ACIDS, DISULFIDE SULFONIC ACIDS OR SALTS THEREOF | DEGUSSA HULS AKTIENGESELLSCHAFT (DE) | 2000-12-26 | — | — | US | claimed |
| EP-0907767-A1 | CYANIDE-FREE ELECTROPLATING BATH FOR DEPOSITION OF GOLD AND GOLD ALLOYS | Degussa Aktiengesellschaft (DE) | 1999-04-14 | — | — | EP | claimed |
| WO-1998003700-A1 | CYANIDE-FREE ELECTROPLATING BATH FOR DEPOSITION OF GOLD AND GOLD ALLOYS | DEGUSSA AKTIENGESELLSCHAFT (DE) | 1998-01-29 | — | — | WO | claimed |
| US-11993862-B2 | Structure including copper plating layer or copper alloy plating layer | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-05-28 | — | — | US | disclosed |
| US-11946153-B2 | Copper or copper alloy electroplating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-04-02 | — | — | US | disclosed |
| WO-2022269779-A1 | METHOD FOR PRODUCING FERRITE FILM | 石原ケミカル株式会社 | 2022-12-29 | — | — | WO | disclosed |
| US-20220316085-A1 | STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER | ISHIHARA CHEMICAL CO., LTD. (JP) | 2022-10-06 | — | — | US | disclosed |
| US-20220127741-A1 | COPPER OR COPPER ALLOY ELECTROPLATING BATH | ISHIHARA CHEMICAL CO., LTD. (JP) | 2022-04-28 | — | — | US | disclosed |
| US-9814138-B2 | Wiring substrate | SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) | 2017-11-07 | — | — | US | disclosed |
| US-20170150603-A1 | WIRING SUBSTRATE | SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) | 2017-05-25 | — | — | US | disclosed |
| US-7918983-B2 | Substrate plating method and apparatus | EBARA CORPORATION (JP) | 2011-04-05 | — | — | US | disclosed |
| US-20100084277-A1 | Composition for copper plating and associated methods | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-04-08 | — | — | US | disclosed |
| US-20100021695-A1 | ENGRAVED PLATE AND SUBSTRATE WITH CONDUCTOR LAYER PATTERN USING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-01-28 | — | — | US | disclosed |
| EP-2098362-A1 | ENGRAVED PLATE AND BASE MATERIAL HAVING CONDUCTOR LAYER PATTERN USING THE ENGRAVED PLATE | Hitachi Chemical Company, Ltd. (JP) | 2009-09-09 | — | — | EP | disclosed |
| US-20070227894-A1 | Substrate plating method and apparatus | EBARA CORPORATION (JP) | 2007-10-04 | — | — | US | disclosed |
| EP-1152071-B1 | Copper plating method | ELECTROPLATING ENG (JP) | 2005-09-07 | — | — | EP | disclosed |
| EP-1152071-A1 | Copper plating method | Electroplating Engineers of Japan Limited (JP) | 2001-11-07 | — | — | EP | disclosed |