SCHEMBL1606996

SCHEMBL1606996

CC(c1cc[nH]c1)S(=O)(=O)O

nearest known ligand 0.31

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.31
KMT2A Q03164 2/20 0.31
SRC P12931 1/20 0.31
KDM4E B2RXH2 1/20 0.30
GMNN O75496 1/20 0.30
LMNA P02545 1/20 0.30
POLB P06746 1/20 0.30
MAPT P10636 1/20 0.30
HPGD P15428 1/20 0.30
PMP22 Q01453 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6546468 0.78 ALDH1A1 (0.34) ALDH1A1KMT2ASRC
SCHEMBL8604697 0.72 CA1 (0.31) TDP1
SCHEMBL2007360 0.72
SCHEMBL310073 0.72
SCHEMBL28757454 0.71 ALDH1A1 (0.36) ALDH1A1KMT2ALMNAPOLBPMP22
SCHEMBL3398714 0.70 SRC (0.54) ALDH1A1KMT2ASRCKDM4EGMNN
SCHEMBL248500 0.70 SRC (0.54) ALDH1A1KMT2ASRCKDM4EGMNN
SCHEMBL3390806 0.70 SRC (0.54) ALDH1A1KMT2ASRCKDM4EGMNN
SCHEMBL8145774 0.68 SRC (0.53) ALDH1A1SRCLMNAMAPTHPGD
Fluoride SCHEMBL9120872 0.68 SRC (0.52) ALDH1A1KMT2ASRCKDM4EGMNN

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106146837-B Poly- 3 ethylsulfonic acid root pyrroles/pyrroles's intercalated hydrotalcite composite material and its preparation technology 淄博职业学院 2018-02-27 CN claimed
CN-106146837-A Poly-3 ethylsulfonic acid root pyrroles/pyrroles's intercalated hydrotalcite composite material and preparation technology thereof 淄博职业学院 2016-11-23 CN claimed
US-8313892-B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2012-11-20 US claimed
CN-106146837-B Poly- 3 ethylsulfonic acid root pyrroles/pyrroles's intercalated hydrotalcite composite material and its preparation technology 淄博职业学院 2018-02-27 CN disclosed
CN-106146837-A Poly-3 ethylsulfonic acid root pyrroles/pyrroles's intercalated hydrotalcite composite material and preparation technology thereof 淄博职业学院 2016-11-23 CN disclosed
EP-2138897-B1 CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN FUJITSU LTD (JP) 2016-08-03 EP disclosed
US-8795951-B2 Material for forming resist sensitization film and production method of semiconductor device FUJITSU LIMITED (JP) 2014-08-05 US disclosed
US-8557144-B2 Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic head FUJITSU LIMITED (JP) 2013-10-15 US disclosed
US-8313892-B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2012-11-20 US disclosed
US-20110081615-A1 MATERIAL FOR FORMING RESIST SENSITIZATION FILM AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-04-07 US disclosed
US-20100009296-A1 MATERIAL FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2138897-A1 MATERIAL FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD Fujitsu Limited (JP) 2009-12-30 EP disclosed
EP-1612603-A2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2006-01-04 EP disclosed
US-20050277055-A1 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2005-12-15 US disclosed
EP-0459255-B1 Method for suppression of electrification HITACHI LTD (JP) 1998-03-18 EP disclosed
US-5589270-A Processed substrate obtained by a process for effecting suppression of electrification HITACHI, LTD. (JP) 1996-12-31 US disclosed
US-5437893-A Method for suppression of electrification HITACHI, LTD (JP) 1995-08-01 US disclosed
US-5256454-A Method for suppression of electrification HITACHI, LTD. (JP) 1993-10-26 US disclosed
EP-0459255-A2 Method for suppression of electrification HITACHI, LTD. (JP) 1991-12-04 EP disclosed