SCHEMBL1607332

SCHEMBL1607332

CCc1cc(OC)ccc1S(=O)(=O)O

nearest known ligand 0.44

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 1/20 0.44
GAA P10253 1/20 0.41
SLC2A1 P11166 2/20 0.41
CA1 P00915 1/20 0.40
CA2 P00918 1/20 0.40
L3MBTL1 Q9Y468 2/20 0.40
MAPT P10636 1/20 0.40
MPL P40238 1/20 0.39
USP2 O75604 1/20 0.39
ALDH1A1 P00352 1/20 0.39
LMNA P02545 1/20 0.39
HTT P42858 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14991138 0.89 HSD17B10 (0.44) HSD17B10GAASLC2A1CA1CA2
SCHEMBL1803007 0.88 HSD17B10 (0.42) HSD17B10GAASLC2A1CA1CA2
SCHEMBL1803005 0.88 HSD17B10 (0.42) HSD17B10GAASLC2A1CA1CA2
SCHEMBL1804050 0.86 HSD17B10 (0.41) HSD17B10GAASLC2A1CA1CA2
SCHEMBL1804056 0.86 ADRA1A (0.44) HSD17B10GAASLC2A1CA1CA2
SCHEMBL25752894 0.86 SLC2A1 (0.44) HSD17B10SLC2A1L3MBTL1MAPTUSP2
SCHEMBL1808452 0.85 HSD17B10 (0.41) HSD17B10GAASLC2A1CA1CA2
SCHEMBL1808453 0.85 CYP2D6 (0.47) HSD17B10GAASLC2A1L3MBTL1ALDH1A1
SCHEMBL1805383 0.83 TAAR1 (0.57) GAAMAPT
SCHEMBL1805381 0.83 HSD17B10 (0.40) HSD17B10GAASLC2A1CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2138897-B1 CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN FUJITSU LTD (JP) 2016-08-03 EP disclosed
US-8795951-B2 Material for forming resist sensitization film and production method of semiconductor device FUJITSU LIMITED (JP) 2014-08-05 US disclosed
US-8557144-B2 Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic head FUJITSU LIMITED (JP) 2013-10-15 US disclosed
US-20110081615-A1 MATERIAL FOR FORMING RESIST SENSITIZATION FILM AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-04-07 US disclosed
US-20100009296-A1 MATERIAL FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2138897-A1 MATERIAL FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD Fujitsu Limited (JP) 2009-12-30 EP disclosed