Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADRB2 | P07550 | 1/20 | 0.41 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.41 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.41 |
| ▸ | THRB | P10828 | 2/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | CA1 | P00915 | 6/20 | 0.37 |
| ▸ | CA2 | P00918 | 6/20 | 0.37 |
| ▸ | CA9 | Q16790 | 6/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | CA12 | O43570 | 1/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | NR5A1 | Q13285 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | LPAR3 | Q9UBY5 | 4/20 | 0.36 |
| ▸ | LPAR2 | Q9HBW0 | 3/20 | 0.36 |
| ▸ | LPAR1 | Q92633 | 2/20 | 0.36 |
| ▸ | NAAA | Q02083 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17644810 | 1.00 | ADRB2 (0.41) | ADRB2ADRB1ADRB3THRBTSHR | |
| SCHEMBL17644807 | 1.00 | ADRB2 (0.41) | ADRB2ADRB1ADRB3THRBTSHR | |
| SCHEMBL28415669 | 0.97 | THRB (0.44) | THRBTSHRCA1CA2CA9 | |
| SCHEMBL29011782 | 0.97 | THRB (0.44) | THRBTSHRCA1CA2CA9 | |
| SCHEMBL1041306 | 0.97 | THRB (0.41) | THRBTSHRCA1CA2CA9 | |
| SCHEMBL7172026 | 0.94 | THRB (0.47) | THRBTSHRCA1CA2CA9 | |
| SCHEMBL2397962 | 0.94 | THRB (0.47) | THRBTSHRCA1CA2CA9 | |
| SCHEMBL9119727 | 0.94 | THRB (0.47) | THRBTSHRCA1CA2CA9 | |
| SCHEMBL11572901 | 0.94 | THRB (0.47) | THRBTSHRCA1CA2CA9 | |
| SCHEMBL766409 | 0.94 | THRB (0.47) | THRBTSHRCA1CA2CA9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| US-11377522-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-05 | — | — | US | disclosed |
| EP-3971229-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-03-23 | — | — | EP | disclosed |
| EP-3957678-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2022-02-23 | — | — | EP | disclosed |
| EP-2573800-A1 | DIFFUSION AGENT COMPOSITION, METHOD OF FORMING AN IMPURITY DIFFUSION LAYER, AND SOLAR CELL | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130061922-A1 | DIFFUSION AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR CELL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-03-14 | — | — | US | disclosed |
| EP-2472655-A1 | Negative electrode base member | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2012-07-04 | — | — | EP | disclosed |
| US-20110079262-A1 | DIFFUSING AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR BATTERY | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-04-07 | — | — | US | disclosed |
| US-20110017291-A1 | DIFFUSING AGENT COMPOSITION FOR INK-JET, AND METHOD FOR PRODUCTION OF ELECTRODE OR SOLAR BATTERY USING THE COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-01-27 | — | — | US | disclosed |
| US-20100119939-A1 | NEGATIVE ELECTRODE BASE MEMBER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| EP-2131423-A1 | NEGATIVE ELECTRODE BASE MEMBER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20080318165-A1 | Composition For Forming Antireflective Film And Wiring Forming Method Using Same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-25 | — | — | US | disclosed |
| US-7332446-B2 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-02-19 | — | — | US | disclosed |
| US-20040188809-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. | 2004-09-30 | — | — | US | disclosed |