SCHEMBL160834

SCHEMBL160834

C=C[SiH](C=C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15674500 0.96
SCHEMBL472894 0.96
SCHEMBL7529941 0.87
SCHEMBL5485754 0.79 KDM4E (0.31)
SCHEMBL3512754 0.75 GAA (0.30)
SCHEMBL9458712 0.74 TSHR (0.37)
SCHEMBL19206041 0.69
SCHEMBL12302823 0.67
SCHEMBL6666453 0.67
SCHEMBL3312313 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1864 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12599693-B2 Augmented thermoset polymer sponges for in situ hemostatic treatment of external and internal wounds UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION, INC. (US) 2026-04-14 US claimed
CN-119683692-A Anti-perovskite type positive electrode material, preparation method thereof and lithium ion battery 南方科技大学 2025-03-25 CN claimed
CN-119462721-A Organosilicon cooling liquid and preparation method thereof 江西海多有机硅材料股份有限公司 2025-02-18 CN claimed
CN-119039588-A Siloxane benzocyclobutene prepolymer, solvent-free high-temperature-resistant low-dielectric ink for inkjet 3D printing, and preparation method and application thereof 大连理工大学 2024-11-29 CN claimed
CN-118541457-A Pressure sensitive adhesive composition, method for its preparation and use in flexible organic light emitting diode applications 美国陶氏有机硅公司 2024-08-23 CN claimed
US-20240238472-A1 AUGMENTED THERMOSET POLYMER SPONGES FOR IN SITU HEMOSTATIC TREATMENT OF EXTERNAL AND INTERNAL WOUNDS UNIVERSITY OF CENTRAL FLORIDA RESEARCH FOUNDATION, INC. 2024-07-18 US claimed
CN-117618292-A Compositions and methods for application to skin 株式会社资生堂 2024-03-01 CN claimed
CN-117561294-A Siloxane-based polymeric materials for efficient rearrangement and curing reactions and having specific degrees of polymerization 硅氧烷有限公司 2024-02-13 CN claimed
CN-117534964-A Semiconductive liquid silicone rubber composition, liquid silicone rubber and application thereof 特变电工科技投资有限公司 2024-02-09 CN claimed
CN-117529512-A Molded flexible polyurethane foam article 赢创运营有限公司 2024-02-06 CN claimed
EP-0270899-B1 ISOSTATIC MOLDING METHOD USING HYDRAULIC SILICONE CRUMB DOW CORNING CORPORATION (US) 1993-06-16 EP claimed
EP-0273264-B1 HYDRAULIC SOLICONE CRUMB WITH IMPROVED HEAT STABILITY DOW CORNING CORPORATION (US) 1992-12-23 EP claimed
US-5171817-A Containing polycyclic polyenes HERCULES INCORPORATED (US) 1992-12-15 US claimed
EP-0509373-A2 Organosilicon compositions containing siloxane elastomers HERCULES INCORPORATED (US) 1992-10-21 EP claimed
EP-0273264-A2 Hydraulic solicone crumb with improved heat stability DOW CORNING CORPORATION (US) 1988-07-06 EP claimed
EP-0270899-A2 Isostatic molding method using hydraulic silicone crumb DOW CORNING CORPORATION (US) 1988-06-15 EP claimed
US-4722957-A ORGANOZIRCONIUM, HAFNIUM AND TITANIUM COMPONENTS FOR STABILITY DOW CORNING CORPORATION (US) 1988-02-02 US claimed
EP-0236903-A2 Hydraulic silicone crumb DOW CORNING CORPORATION (US) 1987-09-16 EP claimed
US-4686271-A Hydraulic silicone crumb DOW CORNING CORPORATION (US) 1987-08-11 US claimed
US-4654382-A TRIGLYCIDYL ETHER OF TRISPHENOL, POLYFUNCTIONAL EPOXY, AND THE REACTION PRODUCT OF AN AROMATIC, DIAMINE, DIVINYLDIS LOXANE, AND BISMALEIMIDE; CURING THE YOKOHAMA RUBBER CO., LTD. (JP) 1987-03-31 US claimed