SCHEMBL19206041

SCHEMBL19206041

C=C[SiH](O[SiH3])O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL512422 0.81
SCHEMBL571084 0.74
SCHEMBL160834 0.69
SCHEMBL15674500 0.67
SCHEMBL6666453 0.67
SCHEMBL472894 0.67
SCHEMBL5014859 0.65
SCHEMBL11595822 0.65
SCHEMBL28184730 0.65
SCHEMBL572633 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117683424-A Antibacterial scratch-resistant coating composition, manufacturing method thereof, transparent sheet containing same and product 台湾塑胶工业股份有限公司 2024-03-12 CN claimed
US-12595339-B2 Preparation of organosilicon compounds with aldehyde functionality DOW SILICONES CORPORATION (US) 2026-04-07 US disclosed
US-20250353968-A1 Preparation of AMINO-FUNCTIONAL Organosilicon Compounds DOW SILICONES CORPORATION 2025-11-20 US disclosed
CN-118742619-A Adhesive composition, adhesive film for circuit connection, and method for producing connection structure 株式会社力森诺科 2024-10-01 CN disclosed
CN-118715300-A Adhesive composition, adhesive film for circuit connection, and method for producing connection structure 株式会社力森诺科 2024-09-27 CN disclosed
CN-118525070-A Adhesive composition, adhesive film for circuit connection, and method for producing connection structure 株式会社力森诺科 2024-08-20 CN disclosed
CN-118510859-A Adhesive composition, adhesive film for circuit connection, and method for producing connection structure 株式会社力森诺科 2024-08-16 CN disclosed
CN-118414396-A Adhesive composition, adhesive film for circuit connection, connection structure, and method for producing connection structure 株式会社力森诺科 2024-07-30 CN disclosed
CN-118401625-A Adhesive tape for circuit connection, connection structure, and method for manufacturing connection structure 株式会社力森诺科 2024-07-26 CN disclosed
CN-117683424-A Antibacterial scratch-resistant coating composition, manufacturing method thereof, transparent sheet containing same and product 台湾塑胶工业股份有限公司 2024-03-12 CN disclosed
CN-117500896-A Curing agent, adhesive composition, adhesive film for circuit connection, connection structure, and method for producing connection structure 株式会社力森诺科 2024-02-02 CN disclosed
CN-116635956-A Adhesive film for circuit connection, connection structure, and method for manufacturing connection structure 株式会社力森诺科 2023-08-22 CN disclosed
US-20230242711-A1 PREPARATION OF ORGANOSILICON COMPOUNDS WITH ALDEHYDE FUNCTIONALITY DOW SILICONES CORPORATION 2023-08-03 US disclosed
US-10005797-B2 Hydrosilylation reaction catalyst KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (JP) 2018-06-26 US disclosed
US-20170233417-A1 HYDROSILYLATION REACTION CATALYST KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (JP) 2017-08-17 US disclosed