Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 2/20 | 0.50 |
| ▸ | LTA4H | P09960 | 4/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.41 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.35 |
| ▸ | NPC1 | O15118 | 2/20 | 0.34 |
| ▸ | RAB9A | P51151 | 2/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.34 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.34 |
| ▸ | RELA | Q04206 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.33 |
| ▸ | CA5A | P35218 | 1/20 | 0.33 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | CA12 | O43570 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.33 |
| ▸ | CA7 | P43166 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL633849 | 0.95 | CA4 (0.50) | CA4LTA4HTSHRKCNA3NPC1 | |
| SCHEMBL3996985 | 0.95 | CA4 (0.50) | CA4LTA4HTSHRKCNA3NPC1 | |
| SCHEMBL19987671 | 0.86 | LTA4H (0.58) | CA4LTA4HTSHRSMN1; SMN2CA1 | |
| SCHEMBL11349941 | 0.86 | CA4 (0.42) | CA4LTA4HTSHRKCNA3NPC1 | |
| SCHEMBL3899105 | 0.86 | CA4 (0.42) | CA4LTA4HTSHRKCNA3NPC1 | |
| SCHEMBL301726 | 0.83 | LTA4H (0.50) | CA4LTA4HTSHRKCNA3TDP1 | |
| SCHEMBL29222960 | 0.83 | LTA4H (0.39) | CA4LTA4HTSHRKCNA3NPC1 | |
| SCHEMBL29072983 | 0.83 | CA4 (0.39) | CA4LTA4HTSHR | |
| SCHEMBL15653550 | 0.80 | LTA4H (0.47) | CA4LTA4HTSHRKCNA3TDP1 | |
| SCHEMBL1608971 | 0.80 | CA4 (0.46) | CA4LTA4HTSHRKCNA3NPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 126 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12473405-B2 | Polyorganosiloxane, polyorganosiloxane composition, cured product, polyorganosiloxane-containing electrolytic solution for electrolytic capacitor, and electrolytic capacitor using same | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-11-18 | — | — | US | disclosed |
| WO-2025053278-A1 | ORGANOPOLYSILOXANE, ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF, ORGANOPOLYSILOXANE FOR NEAR-INFRARED OPTICAL WAVEGUIDE, ORGANOPOLYSILOXANE COMPOSITION FOR NEAR-INFRARED OPTICAL WAVEGUIDE, CURED PRODUCT FOR NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL TRANSMISSION MEMBER, AND NEAR-INFRARED OPTICAL WAVEGUIDE PRODUCTION METHOD | 三菱ケミカル株式会社 | 2025-03-13 | — | — | WO | disclosed |
| WO-2025053279-A1 | ORGANOPOLYSILOXANE, ORGANOPOLYSILOXANE-CONTAINING RESIN COMPOSITION, CURED PRODUCT THEREOF, ORGANOPOLYSILOXANE FOR NEAR-INFRARED OPTICAL WAVEGUIDE, ORGANOPOLYSILOXANE-CONTAINING RESIN COMPOSITION FOR NEAR-INFRARED OPTICAL WAVEGUIDE, CURED PRODUCT FOR NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL TRANSMISSION MEMBER, AND NEAR-INFRARED OPTICAL WAVEGUIDE PRODUCTION METHOD | 三菱ケミカル株式会社 | 2025-03-13 | — | — | WO | disclosed |
| WO-2025053280-A1 | OPTICAL WAVEGUIDE AND OPTICAL MEMBER HAVING OPTICAL WAVEGUIDE | 三菱ケミカル株式会社 | 2025-03-13 | — | — | WO | disclosed |
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| US-20230250237-A1 | POLYORGANOSILOXANE, POLYORGANOSILOXANE COMPOSITION, CURED PRODUCT, POLYORGANOSILOXANE-CONTAINING ELECTROLYTIC SOLUTION FOR ELECTROLYTIC CAPACITOR, AND ELECTROLYTIC CAPACITOR USING SAME | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-10 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| EP-1641908-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-05 | — | — | EP | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| WO-2004113486-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-12-29 | — | — | WO | disclosed |
| US-20040259761-A1 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate | TOKYO OHKA KOGYO CO., LTD. INTEL CORPORATION | 2004-12-23 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| US-6515073-B2 | Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-20010036998-A1 | Anti-reflective coating-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |
| US-5614251-A | Method and liquid coating composition for the formation of silica-based coating film on substrate surface | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-03-25 | — | — | US | disclosed |
| US-5496402-A | Method and liquid coating composition for the formation of silica-based coating film on substrate surface | TOKYO OHKA KOGYO CO, LTD. (JP) | 1996-03-05 | — | — | US | disclosed |